Macroelectronics

Reuss, Robert H.; Hopper, Darrel G.; Park, Jaegeun

doi:10.1557/mrs2006.117

Cited by 63 publications

(36 citation statements)

References 5 publications

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“…According to a more conservative estimate, the steady-state limit is, approximately, 3 2 πh c g [34]. In the present case, it transpires that the coating cracks of a length exceeding 4 μm were under steadystate conditions and their ERR is given by Eq.…”

Section: Numerical Analysis Of the Influence Of Substrate Anisotropymentioning

confidence: 66%

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Influences of roll-to-roll process and polymer substrate anisotropies on the tensile failure of thin oxide films

et al. 2010

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The influence of internal stress anisotropy resulting from anisotropic loading in a roll-to-roll (R2R) process, and polymer substrate anisotropy on the crack onset strain (COS) of thin oxide coatings was analyzed. Experimental data obtained for R2R processed films were compared with data obtained using an isotropic sheet-to-sheet (S2S) process with the same anisotropic substrate. In the R2R case the COS was found to increase by 20% between the transverse direction and the machine direction. In the S2S case the COS was found to be independent of orientation, except at a 45°in-plane orientation with respect to the machine direction, where it was 15% higher. The internal stress in the machine direction could not be determined, presumably due to deposition-induced curvature changes of the polymer substrate, and was therefore fitted to the COS data. Fracture mechanics analysis and finite element modeling of the experimental data showed that the influence of substrate anisotropy was marginal, and that it was the process-induced internal strain in the coating which controlled the COS.

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Section: Numerical Analysis Of the Influence Of Substrate Anisotropymentioning

confidence: 66%

“…Flexible electronic devices including displays and photovoltaic cells are currently being developed using polymer substrates [1][2][3][4]. Such devices present advantages, such as conformability and light weight, and are potentially compatible with cost-effective roll-to-roll (R2R) production processes [5].…”

Section: Introductionmentioning

confidence: 99%

Influences of roll-to-roll process and polymer substrate anisotropies on the tensile failure of thin oxide films

et al. 2010

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“…The most prominent example is in large-area electronics (e.g., back planes for liquid crystal displays), where overall system size rather than operating speed or integration density, is the most important metric. Similar systems that use flexible substrates are presently the subject of widespread research and commercialization efforts because of advantages that they offer in durability, weight, and ease of transport/use (1,2). Stretchable electronics represents a fundamentally different and even more challenging technology, of interest for its unique ability to flex and conform to complex curvilinear surfaces such as those of the human body.…”

mentioning

confidence: 99%

Materials and noncoplanar mesh designs for integrated circuits with linear elastic responses to extreme mechanical deformations

Kim

Song

Choi

et al. 2008

Proc. Natl. Acad. Sci. U.S.A.

640

474

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Electronic systems that offer elastic mechanical responses to highstrain deformations are of growing interest because of their ability to enable new biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This article introduces materials and mechanical design strategies for classes of electronic circuits that offer extremely high stretchability, enabling them to accommodate even demanding configurations such as corkscrew twists with tight pitch (e.g., 90°in Ϸ1 cm) and linear stretching to ''rubber-band'' levels of strain (e.g., up to Ϸ140%). The use of single crystalline silicon nanomaterials for the semiconductor provides performance in stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators, and differential amplifiers, suggest a valuable route to high-performance stretchable electronics.flexible electronics ͉ stretchable electronics ͉ semiconductor nanomaterials ͉ plastic electronics ͉ buckling mechanics I ncreasingly important classes of application exist for electronic systems that cannot be formed in the usual way, on semiconductor wafers. The most prominent example is in large-area electronics (e.g., back planes for liquid crystal displays), where overall system size rather than operating speed or integration density, is the most important metric. Similar systems that use flexible substrates are presently the subject of widespread research and commercialization efforts because of advantages that they offer in durability, weight, and ease of transport/use (1, 2). Stretchable electronics represents a fundamentally different and even more challenging technology, of interest for its unique ability to flex and conform to complex curvilinear surfaces such as those of the human body. Several promising approaches exist, ranging from the use of stretchable interconnects between rigid amorphous silicon devices (3) to ''wavy'' layouts in singlecrystalline silicon CMOS circuits (4), both on elastomeric substrates, to net-shaped structures in organic electronics on plastic sheets (5). None offers, however, the combination of electrical performance (high electron and hole mobility), scalability (with relatively modest modifications to conventional microelectronic technologies), integrated circuit applicability in complementary designs and mechanical properties required of some of the most demanding, and most interesting, systems. Here, we introduce design concepts for stretchable electronics th...

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“…3,16,17 Figure 1.4 captures a concept long championed by many display manufacturers. It proposes that at some point in the future, the display manufacturing capability will be able to provide not just a display, but also an entire wireless laptop tablet complete with camera, microphone, and solar cell for power.…”

Section: Macroelectronics Potentialmentioning

confidence: 99%