Machining characterization of the nano-lithography process using atomic force microscopy

Fang, Te‐Hua; Weng, Cheng‐I; Chang, Jee-Gong

doi:10.1088/0957-4484/11/3/308

Cited by 110 publications

(49 citation statements)

References 13 publications

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“…According to the experimental results as shown in Fig. 9, the scratching depth is increased gradually from 70 nm in 1 scratching cycle to 170 nm in 10 cycles, the same trend as other scholars" reports [7,30]. Besides the increase of the scratching depth, it can also be seen that the groove wall, especially the right side, in 1 scratching cycle is coarser than the multi scratching.…”

Section: Scratching Cyclessupporting

confidence: 69%

“…In the AFM tip based mechanical nanomanufacturing, the effects of machining parameters including applied normal load, scratching direction, scratching cycles, scratching speed and scratching feed on the machined depth and surface roughness have been investigated by many scholars in the last decades [7][8][9][10][11][12][13]. Recently, some researchers focus on the theoretical modeling of scratching depth.…”

Section: Introductionmentioning

confidence: 99%

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Experimental investigation of the tip based micro/nano machining

Guo

Tian

Liu

et al. 2017

Applied Surface Science

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Based on the self-developed three dimensional micro/nano machining system, the effects of machining parameters and sample material on micro/nano machining are investigated. The micro/nano machining system is mainly composed of the probe system and micro/nano positioning stage. The former is applied to control the normal load and the latter is utilized to realize high precision motion in the xy plane. A sample examination method is firstly introduced to estimate whether the sample is placed horizontally. The machining parameters include scratching direction, speed, cycles, normal load and feed. According to the experimental results, the scratching depth is significantly affected by the normal load in all four defined scratching directions but is rarely influenced by the scratching speed. The increase of scratching cycle number can increase the scratching depth as well as smooth the groove wall. In addition, the scratching tests of silicon and copper attest that the harder material is easier to be removed. In the scratching with different feed amount, the machining results indicate that the machined depth increases as the feed reduces. Further, a cubic polynomial is used to fit the experimental results to predict the scratching depth. With the selected machining parameters of scratching direction d3/d4, scratching speed 5μm/s and feed 0.06μm, some more micro structures including stair, sinusoidal groove, Chinese character "田", "TJU" and Chinese panda have been fabricated on the silicon substrate.

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Section: Scratching Cyclessupporting

confidence: 69%

Section: Introductionmentioning

confidence: 99%

Experimental investigation of the tip based micro/nano machining

Guo

Tian

Liu

et al. 2017

Applied Surface Science

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show abstract

“…AFM probes can be used as cutting tools and microstructures in semiconductors, optoelectronics, and metal surfaces (Tseng et al [1]). Fang et al [2] used AFM probes in scribing experiments involving a Si substrate coated with an Al film, and found that the scratch depth increased with the applied down force on the probe and the number of scribing cycle. The applied down force had the most notable effect.…”

Section: Introductionmentioning

confidence: 99%

A Study of Specific Down Force Energy and Cutting Depth of Sapphire Substrate Affected by Different Dipping Temperatures of Slurry

Lin¹,

Ding²,

Chen³

2017

ujme

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This article studies the change of specific down force energy and cutting depth of sapphire substrate when sapphire substrates were dipped in different temperatures of slurry. It involved applying small down force in cutting sapphire substrates by atomic force microscope (AFM) before dipping them in slurry in order to obtain the SDFE value of without dipping slurry. Next, small down force was applied to cut sapphire substrates dipped in slurry for varying dipping temperatures to obtain the SDFE reaction values of dipping slurry with different dipping temperatures. Nanocutting was performed by AFM with a small constant down force to obtain the cutting depths of sapphire substrate for the different dipping temperatures of slurry. The results of this study indicated that the dipping temperature of slurry increased, the SDFE reaction value of sapphire substrate decreased and the cutting depth of sapphire substrate with a constant down force increased.

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“…[1][2][3] One of the applications that require high throughput nano-machining is repair of high photomasks for optical lithography.…”

Section: Introductionmentioning

confidence: 99%

Simultaneous AFM nano-patterning and imaging for photomask repair

Keyvani

Tamer

et al. 2016

SPIE Proceedings

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In this paper we present a new AFM based nano-patterning technique that can be used for fast defect repairing of high resolution photomasks and possibly other high-speed nano-patterning applications. The proposed method works based on hammering the sample with tapping mode AFM followed by wet cleaning of the residuals. On the area where a specific pattern should be written, the tip-sample interaction force is tuned in a controlled manner by changing the excitation frequency of the cantilever without interrupting the imaging process. Using this method several patterns where transferred to different samples with imaging speed. While the pattern was transferred to the sample in each tracing scan line, the patterned sample was imaged in retracing scan line, thus the outcome was immediately visible during the experiment.

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Machining characterization of the nano-lithography process using atomic force microscopy

Cited by 110 publications

References 13 publications

Experimental investigation of the tip based micro/nano machining

Experimental investigation of the tip based micro/nano machining

A Study of Specific Down Force Energy and Cutting Depth of Sapphire Substrate Affected by Different Dipping Temperatures of Slurry

Simultaneous AFM nano-patterning and imaging for photomask repair

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