2006
DOI: 10.4028/0-87849-986-5.210
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Machining Characteristics Analysis of Nano Ceramics in Ultra Precision Grinding Machining

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“…Yin et al (2004) developed a kind of high-quality grinding protocols for polycrystalline silicon carbide spherical surfaces and achieved surfaces with form accuracy peak-to-valley (PV) of 0.21-0.59 wave length (0.13-0.37 m) and surface roughness of 9.92-17.22 nm Ra. Liu et al (2006) analyzed the mechanism of surface machining of nano-ceramics materials in ultra-precision grinding processes and gave a new formulation for critical grinding depth. As a high efficiency and precision method, machining with ultrasonic assistance have brought a new alternative technique to traditional way for nano-ceramic machining.…”
Section: Introductionmentioning
confidence: 99%
“…Yin et al (2004) developed a kind of high-quality grinding protocols for polycrystalline silicon carbide spherical surfaces and achieved surfaces with form accuracy peak-to-valley (PV) of 0.21-0.59 wave length (0.13-0.37 m) and surface roughness of 9.92-17.22 nm Ra. Liu et al (2006) analyzed the mechanism of surface machining of nano-ceramics materials in ultra-precision grinding processes and gave a new formulation for critical grinding depth. As a high efficiency and precision method, machining with ultrasonic assistance have brought a new alternative technique to traditional way for nano-ceramic machining.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, in ultra-precision micromachining of brittle materials, elliptical vibration was capable of ductile machining without a brittle mode [11]. And Zhao et al discussed theoretical critical grinding depth based on the ductile removal mechanisms of ultrasonic vibration grinding for the ceram-ics [5,12,13]. This paper studied the ultrasonic vibration effect of diamond grinding tool on the ceramic machining.…”
Section: Introductionmentioning
confidence: 99%