Machinability of SiCf/SiC ceramic matrix composites using longitudinal-torsional coupled rotary ultrasonic machining

The debonding fiber defects on the grinding surface of SiO2f/SiO2 ceramic matrix composites deteriorate the service performance of related components. The low-damage process window is the key information to suppress machining damage by controlling grinding parameters. A mechanism model for debonding fiber damage on SiO2f/SiO2 surface was first proposed in this paper by the large deformation analysis for SiO2 fibers during rotary ultrasonic face grinding (RUFG). The established mechanism model built a bridge between grinding parameters and damage inhibition by integrating the ultrasonic stress effect, grinding force calculation, and critical fracture curvature cutting-off criterion of SiO2 fibers. The modeling mechanism for fiber deformation and fracture in grinding was validated by in situ observation of single abrasive grit scratching experiments. Besides, the low debonding damage process window predicted by the model was verified by experimental results and could be adopted to suppress the debonding fiber damage in grinding. The affected mechanism of fiber orientation, ultrasonic amplitude, and fiber-matrix interface strength on the low debonding damage process window was analyzed based on the theoretical and experimental results. The damage inhibition effect of the RUFG process was limited by the low fiber-matrix interface strength and axial cutter-relieving movement component. The ultrasonic-assisted vibration exerted its auxiliary effects through the ultrasonic stress effect and force reduction effect. The prerequisite for exerting the damage inhibition effect of RUFG was that the fiber-matrix interface strength was sufficient to resist the negative influence of the ultrasonic stress effect.

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Grinding force model for ultrasonic assisted grinding of γ-TiAl intermetallic compounds and experimental validation

Li,

Yang,

Liu

et al. 2024

Reviews on Advanced Materials Science

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The introduction of ultrasonic vibration in the grinding process of γ-TiAl intermetallic compounds can significantly reduce its processing difficulty. It is of great significance to understand the grinding mechanism of γ-TiAl intermetallic compounds and improve the processing efficiency by studying the mechanism of ordinary grinding of abrasive grains. Based on this, this study proposes a grinding force prediction model based on single-grain ultrasonic assisted grinding (UAG) chip formation mechanism. First, the prediction model of grinding force is established based on the chip formation mechanism of abrasive sliding ordinary grinding and the theory of ultrasonic assisted machining, considering the plastic deformation and shear effect in the process of material processing. Second, the UAG experiment of γ-TiAl intermetallic compounds was carried out by using diamond grinding wheel, and the unknown coefficient in the model was determined. Finally, the predicted values and experimental values of grinding force under different parameters were compared to verify the rationality of the model. It was found that the maximum deviation between the predicted value of tangential force and the actual value is 23%, and the maximum deviation between the predicted value of normal force and the actual value is 21.7%. In addition, by changing the relevant parameters, the model can predict the grinding force of different metal materials under different processing parameters, which is helpful for optimizing the UAG parameters and improving the processing efficiency.

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Machinability of SiCf/SiC ceramic matrix composites using longitudinal-torsional coupled rotary ultrasonic machining

Cited by 3 publications

References 29 publications

Enhanced manufacture technology based on emission reduction and carbon reduction in cutting and grinding

Enhanced manufacture technology based on emission reduction and carbon reduction in cutting and grinding

Debonding Fiber Damage Mechanism Modeling for Machining Damage Inhibition During Rotary Ultrasonic Face Grinding SiO2f/SiO2

Grinding force model for ultrasonic assisted grinding of γ-TiAl intermetallic compounds and experimental validation

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