1991
DOI: 10.1049/ip-b.1991.0025
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Lumped parameter thermal model for electrical machines of TEFC design

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Cited by 691 publications
(356 citation statements)
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“…To model the thermal behavior of SRMs, lumped parameter thermal networks (LPTNs) [57] or computational fluid dynamics (CFDs) and FEAs [58] are used. Space-resolved lumped parameter thermal networks have been proposed to predict the hot-spot temperature as well as the temperature at any userspecified spot within the machine [59]- [62].…”
Section: B Thermal Behaviormentioning
confidence: 99%
“…To model the thermal behavior of SRMs, lumped parameter thermal networks (LPTNs) [57] or computational fluid dynamics (CFDs) and FEAs [58] are used. Space-resolved lumped parameter thermal networks have been proposed to predict the hot-spot temperature as well as the temperature at any userspecified spot within the machine [59]- [62].…”
Section: B Thermal Behaviormentioning
confidence: 99%
“…Тому двошарова обмотка статора може мо-делюватися еквівалентним однорідним середовищем, яке характеризується еквівалентною (ефективною) теплопро-відністю. Еквівалентна теплопровідність, що залежить від співвідношення між діаметрами голого та ізольованого дроту, може бути розрахована за методиками, які запро-поновано у [25,26]:…”
Section: викладення основного матері-алу та аналіз отриманих резуль-тunclassified
“…The compact thermal model or empirical lumpedelement model [5,12] is quite simple and fast to solve, but the extraction process to get the model is very computationally expensive. Lumped-parameter model (LPM) is widely used in thermal analysis of electrical machines [13], however it has not been paid much attention in the power electronics field. The scholars from University of Parma [12] used two resistor network of LPM for thermal analysis of power electronic devices and power device assemblies.…”
Section: Fig1 Dimension Of the Heat Sink And Power Devicementioning
confidence: 99%