LTCC for RF modules

Hunt, Brian D.; Devlin, L.M.

doi:10.1049/ic:20000421

Cited by 10 publications

(2 citation statements)

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“…It boasts high flexural strength and mechanical stability with up to 30 layers that can be co-fired to form a complex multilayer interposer. As no active components can be fabricated into the LTCC, its use remains limited for surface mount packaging of RF modules. , Figure shows a high-density interposer fabricated by Kyocera. It boasts 3300 RF and DC connections and requires the routing of the electrical links on 20 layers of the ceramic, and the interposer area is 98 mm × 68 mm to accommodate the 17 compression connectors.…”

Section: Electronic–photonic Co-packagingmentioning

confidence: 99%

Integrated Photonics Packaging: Challenges and Opportunities

et al. 2022

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Packaging of photonic integrated circuit (PIC) chips is an essential and critical step before they can be integrated into functional optoelectronic systems. Photonic packaging is however often a major barrier impeding scalable deployment of PIC technologies given its high cost and limited throughput. This perspective addresses the technical challenges and discusses promising strategies and research directions to overcome the "packaging bottleneck".

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Section: Electronic–photonic Co-packagingmentioning

confidence: 99%

Integrated Photonics Packaging: Challenges and Opportunities

et al. 2022

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“…Microwave filters are essential components in MCM. Lately, the low temperature co-fired ceramic (LTCC) multilayer packaging technology is becoming more and more popular for the production of highly, complex multilayer RF modules [1]. LTCC is a multilayer ceramic technology, which provides an ability to embed passive components in layers while the active elements are mounted on the surface layer.…”

Section: Introductionmentioning

confidence: 99%

Five-pole LTCC cavity filter for wireless applications at 34GHz

Yuan

Mou

et al. 2011

2011 IEEE International Conference on Microwave Technology &Amp; Computational Electromagnetics

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System-on-Package (SOP) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Band pass filter is one of the most important components in the SOP. In this paper, a 5-pole band pass cavity filter consisting of via walls was designed as a system-on-package solution for RF front-end modules at 34GHz, adopting low-temperature co-fired ceramics (LTCC). The BPF is vertically made up of five cavity resonators with via walls and has been simulated and optimized by Ansoft HFSS. This filter which has been realized in a seven layers ceramic substrate exhibits an insertion loss of 0.89 dB at the center frequency of 34 GHz, a rejection 37.5 dB(32.9GHz and 35.8GHZ), and 3dB bandwidth approximately 4.5%(~ 1.5 GHz). Due to its vertical structure, this filter shows promising application potentials in miniaturized SOP.

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Ferroelectricity

2017

Ferroelectrics

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LTCC for RF modules

Cited by 10 publications

References 0 publications

Integrated Photonics Packaging: Challenges and Opportunities

Integrated Photonics Packaging: Challenges and Opportunities

Five-pole LTCC cavity filter for wireless applications at 34GHz

Ferroelectricity

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