&lt;title&gt;Screen printed organic thin film transistors (OTFTs) on a flexible substrate&lt;/title&gt;

Gray, Caprice; Wang, Jianna; Duthaler, Gregg; Ritenour, Andrew; Drzaic, Paul

doi:10.1117/12.451470

Cited by 27 publications

(18 citation statements)

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“…Several different dielectrics have been investigated so far including poly vinyl phenol (PVP), polyimide, benzocyclobutene (BCB) or parylene [5][6][7][8][9][10][11].…”

Section: Polycrystalline Thin Film Transistors On Organic Dielectricsmentioning

confidence: 99%

Pentacene thin film transistors on large area compatible gate dielectrics

Knipp

Street

2004

Journal of Non-Crystalline Solids

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“…Several different dielectrics have been investigated so far including poly vinyl phenol (PVP), polyimide, benzocyclobutene (BCB) or parylene [5][6][7][8][9][10][11].…”

Section: Polycrystalline Thin Film Transistors On Organic Dielectricsmentioning

confidence: 99%

Pentacene thin film transistors on large area compatible gate dielectrics

Knipp

Street

2004

Journal of Non-Crystalline Solids

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“…The measurements were performed at 5 different current biases in the range of 1 A-4.7 A at atmospheric environment. The responsivity measurement showed a linear dependence on the bias current as predicted by (2). The detectivity, while showing a linear dependence on at low current levels where the thermal noise is dominant, saturated above a certain bias level due to the emergence of noise at low frequencies.…”

Section: Performance Of Flexible Microbolometersmentioning

confidence: 84%

Microbolometers on a Flexible Substrate for Infrared Detection

2004

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Uncooled semiconducting YBaCuO infrared microbolometers have been fabricated on a flexible polyimide substrate formed by spin-coating a silicon wafer with a release layer. The wafer was used as a carrier for the flexible substrate during fabrication. The finished microbolometers on the flexible substrate showed a temperature coefficient of resistance (TCR)which is comparable to the TCR values observed for semiconducting YBaCuO microbolometers fabricated directly on Si.In order to provide protection and better mechanical integrity, some of the devices were encapsulated. The microbolometers attained a responsivity and detectivity as high as 3.5 10 3 V W and 1 10 7 cm Hz 1 2 W, respectively, at 2.88 A of current bias. The responsivity and detectivity of the encapsulated microbolometers, on the other hand, were 1.6 10 3 V W and 4.9 10 6 cm Hz 1 2 W, respectively at 1 A of current bias.Spin-coated liquid polyimide solved two major problems previously encountered with the solid polyimide sheets when used as a flexible substrate. First, flatness of the flexible substrate was maintained with no air bubbles. Second, the thermal expansion of the flexible substrate during the fabrication process due to thermal cycling was minimal. All measurements reported in this paper, were taken prior to releasing the flexible substrate from the Si wafer containing the finished microbolometers.Index Terms-Flexible substrates, infrared detectors, smart skin, yttrium barium copper oxide (YBaCuO).

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“…Resolution is limited by ink formulation, thread thickness and density. Although commonly used in the printing of labels, signs as well clothing, screen printing has been widely used in flexible and printed electronics for a variety of devices including conductors [8], TFTs [9], RFID antennas [10]. An impressive work was done by Krebs et al [11], who presented a fully screen printed, flexible solar cell based on a blend of organic acceptor and donor materials.…”

Section: Screen Printingmentioning

confidence: 99%

Technological Integration in Printed Electronics

Rivadeneyra¹,

Loghin²,

Falco³

2018

Flexible Electronics

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Conventional electronics requires the use of numerous deposition techniques (e.g. chemical vapor deposition, physical vapor deposition, and photolithography) with demanding conditions like ultra-high vacuum, elevated temperature and clean room facilities. In the last decades, printed electronics (PE) has proved the use of standard printing techniques to develop electronic devices with new features such as, large area fabrication, mechanical flexibility, environmental friendliness and-potentially-cost effectiveness. This kind of devices is especially interesting for the popular concept of the Internet of Things (IoT), in which the number of employed electronic devices increases massively. Because of this trend, the cost and environmental impact are gradually becoming a substantial issue. One of the main technological barriers to overcome for PE to be a real competitor in this context, however, is the integration of these non-conventional techniques between each other and the embedding of these devices in standard electronics. This chapter summarizes the advances made in this direction, focusing on the use of different techniques in one process flow and the integration of printed electronics with conventional systems.

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<title>Screen printed organic thin film transistors (OTFTs) on a flexible substrate</title>

Cited by 27 publications

References 0 publications

Pentacene thin film transistors on large area compatible gate dielectrics

Pentacene thin film transistors on large area compatible gate dielectrics

Microbolometers on a Flexible Substrate for Infrared Detection

Technological Integration in Printed Electronics

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