&lt;title&gt;Profile defects in novolac/DNQ resists: I. formation of microgrooves&lt;/title&gt;

Trefonas, Peter; Mirth, George P.; Monaghan, Michael J.; Turci, Pamela; DeJordy, L.; Meister, Catherine C.

doi:10.1117/12.210345

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2005

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A Self-regulation Mechanism of the Resist Development Process in Integrated Circuit Fabrication and its Phase-space Picture

Karafyllidis

2005

J Computer-Aided Mater Des

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Lithography is the most important process in integrated circuit fabrication. Lithographic profile defect simulator based on cellular automata revealed a self-regulation mechanism of the resist development process, which is expressed as a tendency of the etch-front to retain its parabolic shape. The phase-space picture of this mechanism is an attractor and it is certified that the resit-etchant system spends much time near the unperturbed state.

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A Self-regulation Mechanism of the Resist Development Process in Integrated Circuit Fabrication and its Phase-space Picture

Karafyllidis

2005

J Computer-Aided Mater Des

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The quantitation of surface modifications in 200 and 300 mm wafer processing with an automated contact angle system

Carpio¹,

Hudson²

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)

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<title>Profile defects in novolac/DNQ resists: I. formation of microgrooves</title>

Cited by 2 publications

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A Self-regulation Mechanism of the Resist Development Process in Integrated Circuit Fabrication and its Phase-space Picture

A Self-regulation Mechanism of the Resist Development Process in Integrated Circuit Fabrication and its Phase-space Picture

The quantitation of surface modifications in 200 and 300 mm wafer processing with an automated contact angle system

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