&lt;title&gt;Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)&lt;/title&gt;

Yoshimura, Tetsuzo; Roman, James; Takahashi, Yasuhito; Lee, Michael; Chou, Bill; Beilin, S.I.; Wang, Wen-Chou V.; Inao, M.

doi:10.1117/12.384398

Cited by 16 publications

(10 citation statements)

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“…[3][4][5][6] Figure 14 shows an example of SORT applied to heterogeneous device integration in 3D-MOSS fabrication. First, a thin-film microoptical switch array, micro-lens array, and micro mirror array are prepared on different device growth wafers.…”

Section: Materialõcost-saving Heterogeneous Integration Processmentioning

confidence: 99%

“…2, which is the base of 3D-MOSS, is reviewed following previous works of the author. [3][4][5][6] In S-FOLM, first the basic elements are prepared, including electrical parts like large-scale integrated circuit ͑LSI͒ and multichipmodule ͑MCM͒, and OE films that contain thin-film ͑TF͒ VCSEL, photodetector ͑PD͒, optical switch, LSI, and so on. By combining these elements, many kinds of products are made such as a smart pixel, OE MCM, OE printed circuit board ͑PCB͒, and 3D-stack-OE-MCM.…”

Section: S-folm Conceptmentioning

confidence: 99%

“…9 Based on the results, total system performance of 3D-MOSS for a 32ϫ32 Banyan network is assessed, including system size, operation voltage, switching speed, power consumption, and insertion loss. Finally, a material/cost-saving heterogeneous integration process called ''photolithographic packaging with selectively occupied repeated transfer ͑PL-Pack with SORT͒,'' [3][4][5][6] which is based on the epitaxial liftoff method, 10,11 is briefly described as a method of 3D-MOSS fabrication.…”

Section: Introductionmentioning

confidence: 99%

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Three-dimensional micro-optical switching system architecture using slab-waveguide-based micro-optical switches

et al. 2003

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A high-speed, large-scale architecture, three-dimensional micro-optical switching system (3-D MOSS) is proposed. A switching network is divided into subnetwork blocks, followed by stacking them to construct a multilayer structure. The interblock waveguide connection is replaced with short-distance vertical optical wiring, that is, optical z connections. Thus, 3D-MOSS, in contrast with conventional planar structures, reduces waveguide cross points, wiring length, and system size. Expected applications are switching for fiber communications, reconfigurable 3-D micro optoelectronic (OE) systems, and so on. 3D-MOSS consists of OE films, in which thin-film high-speed micro-optical switches are embedded. Two critical issues for 3D-MOSS, micro-optical switch and optical z connection, are investigated. The beam propagation method (BPM) calculation shows that waveguide-prism-deflector microoptical switch (WPD-MOS), in which prism-shaped electrodes are formed on an electro-optic slab waveguide, is suitable for the microoptical switch. The finite difference time domain method (FDTD)/BPM coupled simulation demonstrates a possibility of low-loss optical z connection in a 4-m width waveguide-based 3-D micro-optical network. Performance of 3D-MOSS for a 32ϫ32 Banyan network is assessed as follows: system size is 2250 (length)ϫ600 (width)ϫ320 (height) m 3 , operation voltage 110 V, switching speed Ͻ1 s, power consumption 520 mW at a switching rate of 3ϫ10 5 /s, and maximum insertion loss 14 dB. This indicates the viability of 3D-MOSS from viewpoints of channel count, switching speed, thermal management, and power budget. A material/cost-saving device integration process ''photolithographic packaging with selectively occupied repeated transfer (PL-Pack with SORT)'' is briefly described as an example of a fabrication method for 3D-MOSS.

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Section: Materialõcost-saving Heterogeneous Integration Processmentioning

confidence: 99%

Section: S-folm Conceptmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Three-dimensional micro-optical switching system architecture using slab-waveguide-based micro-optical switches

et al. 2003

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“…In recent years, integrated optical interconnects with embedded thin-film optical devices [6][7][8][9][10][11][12] have been received much attention as the next-generation systems, including three-dimensional (3D) [11][12][13][14][15][16][17][18] and nano-scalewaveguide-based optical interconnects [14,[19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Polymer waveguides self-organized by two-photon photochemistry for self-aligned optical couplings with wide misalignment tolerances

Yoshimura

Takeda

Sato

et al. 2016

Optics Communications

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a b s t r a c tSelf-organized optical waveguides formed in a photopolymer using two-photon photochemistry is proposed for self-aligned optical couplings involving nano-scale optical devices with wide tolerances in lateral misalignments. Simulations based on the finite-difference time-domain method revealed that on introducing a 400-nm write beam and a 780-nm write beam into the two-photon photopolymer respectively from two 600-nm-wide waveguides facing each other with 32 μm gap a self-aligned coupling waveguide called a two-photon self-organized lightwave network (SOLNET) is formed between the two waveguides. The lateral misalignment tolerance was found to be 3000 nm, which is five times larger than the misalignment limit of $ 600 nm in waveguides formed by conventional one-photon photochemistry. Preliminary experiments demonstrated that the two-photon SOLNETs are formed between multimode optical fibers by introducing a 448-nm write beam and a 780-nm (or 856-nm) write beam from the fibers into a photosensitive organic/inorganic hybrid material, SUNCONNECT s , with doped camphorquinone (or biacetyl).

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“…Three-dimensional (3D) optical wiring [1][2][3][4][5] is applicable to integrated optical interconnects and solar energy conversion systems. The 3D architecture is based on device-embedded optical waveguide films with 45 o mirrors of core end facets.…”

Section: Introductionmentioning

confidence: 99%

Optical waveguide films with two-layer skirt-type core end facets for beam leakage reduction at 45° mirrors

et al. 2008

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Three-dimensional optical wiring, consisting of stacked optical waveguide films with 45 o mirrors, is a backbone for integrated optical interconnects and solar energy conversion systems. By using the self-organized lightwave network (SOLNET) technique, we observed leakage/scattering of guided light beams at 45 o mirrors of core end facets in optical waveguide films. When 405-nm write beams were introduced into the optical waveguide having a photo-refractive material layer on the back, three excess lines of SOLNET, which may be caused by the guided beam tunneling into the cladding film and by the refraction at core end facet corners, were grown from the 45 o mirror, in addition to a vertical waveguide of SOLNET formed by reflected beams. To reduce the leakage/scattering, we proposed the two-layer skirttype cores with low-index (LI) part and high-index (HI) part. The LI part located between the HI part and the cladding film prevents the guided beams from tunneling into the film. The skirt-type core end facets put the corners away from the beam path. These effects were confirmed by simulations using the beam propagation method and the finite difference time domain method. Optical waveguide films with the proposed structure were fabricated by the built-in mask method.

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<title>Optoelectronic scalable substrates based on film/Z-connection and its application to film optical link module (FOLM)</title>

Cited by 16 publications

References 0 publications

Three-dimensional micro-optical switching system architecture using slab-waveguide-based micro-optical switches

Three-dimensional micro-optical switching system architecture using slab-waveguide-based micro-optical switches

Polymer waveguides self-organized by two-photon photochemistry for self-aligned optical couplings with wide misalignment tolerances

Optical waveguide films with two-layer skirt-type core end facets for beam leakage reduction at 45° mirrors

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