1999
DOI: 10.1117/12.354847
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<title>Multiple-line generation over high angle using hybrid parabolic profile and binary surface-relief phase element</title>

Abstract: A hybrid diffractive optical element (HDOE) capable of splitting a monochromatic laser beam into an arbitrary number of lines over high angle is presented. The element is formed by a continuous parabolic surface-relief phase grating and a binary surface-relief computer generated phase hologram. The parabolic profile was generated into a thick photo resist and the binary surface-relief was generated into a quartz substrate.

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Cited by 3 publications
(2 citation statements)
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“…The remaining photoresist was then removed in an acetone bath at 70 degrees Celsius, followed by an isopropyl alcohol immersion at the same temperature. The fused silica substrate was then plasma etched [9] in a home built Reactive Ion Etching (RIE) system [10], using the following process conditions: 50 mTorr pressure chamber, 60 W RF power (0.33 W/cm 2 ), using CF 4 gas (20 sccm flow rate). With these process conditions, an etch rate of 15.4 nm/min, with a cathode self-bias of 400Vdc, was obtained.…”
Section: Generation Of the Phase Modulation In The Proximity Printingmentioning
confidence: 99%
“…The remaining photoresist was then removed in an acetone bath at 70 degrees Celsius, followed by an isopropyl alcohol immersion at the same temperature. The fused silica substrate was then plasma etched [9] in a home built Reactive Ion Etching (RIE) system [10], using the following process conditions: 50 mTorr pressure chamber, 60 W RF power (0.33 W/cm 2 ), using CF 4 gas (20 sccm flow rate). With these process conditions, an etch rate of 15.4 nm/min, with a cathode self-bias of 400Vdc, was obtained.…”
Section: Generation Of the Phase Modulation In The Proximity Printingmentioning
confidence: 99%
“…The Si0 2 substrate was etched [10] using a home built plasma etching system [11], creating a four phase levels surface relief. After the etching process, a reflective aluminum layer is deposited over the phase relief using a thermal evaporation process [6].…”
Section: Dtud16-l/159mentioning
confidence: 99%