&lt;title&gt;Multilayer optical fan-out device composed of stacked monomode waveguides&lt;/title&gt;

Streppel, Ulrich; Dannberg, Peter; Waechter, Christoph A.; Braeuer, Andreas H.; Nicole, Pierre; Froehlich, L.; Houbertz, R.; Popall, Michael

doi:10.1117/12.447635

Cited by 7 publications

(6 citation statements)

References 3 publications

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“…This application from the field of high frequency antennas is developed for an optical signal summation, which can be done in the optical band with lowest device volume in contrast to the microwave equivalents 18 . For those applications it has to be taken into account, that for standard microwave technology the needed volume is proportional to the cubic of the reverse minimum carrier frequency.…”

Section: Fabrication Of a Four Layer Stackmentioning

confidence: 99%

“…Hybrid inorganic-organic ORMOCER  s respond to the different demands mentioned above. The members of this polymer class are synthesized in polycondensation reactions (sol-gel processing) of commercially available alkoxysilanes 18 . This results in the formation of Si-O-Si oligomers, which can be additionally cross-linked by organic groups, e.g., methacrylate, in a second processing step, leading to a three-dimensional polymer network.…”

Section: Materials Selectionmentioning

confidence: 99%

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<title>Realization of a vertical integration scheme for polymer waveguides by a novel stacking technology</title>

Streppel

Dannberg

Waechter

et al. 2001

Design, Manufacturing, and Testing of Planar Optical Waveguide Devices

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The rapid growth of communication continuously demands an increasing number of data transport channels. We present an approach towards a substantial growth of channel numbers within the integrated optical waveguide chip. This is accomplished by introducing a vertical integration scheme, which is implemented with stacked polymer waveguides. To meet the requirements of stacked optical waveguide devices concerning index distributions, cross-sections and alignment precision, a novel fabrication technology has been developed. During the stacking process several fundamental problems, e.g., index inhomogenities caused by diffusion effects and distortion of the desired waveguide structures with increasing stack height, have to be avoided. In addition, the non-linear index change of the polymer materials during polymerization has to be carefully considered to come to well defined index distributions, which are the same in all layers. A solution meeting these requirements is presented using standard processes like UV patterning in combination with thermal curing steps.

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Section: Fabrication Of a Four Layer Stackmentioning

confidence: 99%

Section: Materials Selectionmentioning

confidence: 99%

<title>Realization of a vertical integration scheme for polymer waveguides by a novel stacking technology</title>

Streppel

Dannberg

Waechter

et al. 2001

Design, Manufacturing, and Testing of Planar Optical Waveguide Devices

Self Cite

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“…Weitere optische Leiter beruhen auf dem Prinzip mehrlagiger Aufbauten, bei denen die mittlere von drei Lagen den optischen Leiter darstellt, dessen Material einen hö heren Brechungsindex aufweisen muss als das ihn umgebende Material. Die Strukturierung der Materialien, die wie Positivresists reagieren, findet mittels Photolithographie statt (Streppel et al, 2001). Des Weiteren gibt es Laserdirektschreibeprozesse, mit denen Strukturen oberflä chlich eingeschrieben werden kö nnen (Tooley et al, 2001).…”

Section: Optische Verbindungstechnik Und Leiterplattenunclassified

Die Leiterplatte wandelt sich zum elektrischen System

Riester

2006

Elektrotech. Inftech.

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Das Grundprinzip bei der Herstellung von Leiterplatten ist in den letzten 60 Jahren gleichgeblieben. Stand der Technik ist nach wie vor das € A Atzen des Leiterdesigns aus einer Kupferschicht. Mit der HDI-Technologie (High Density Interconnect) wurde Ende der 1990er Jahre die wesentlichste € A Anderung der letzten Jahre in den Aufbauten von Leiterplatten eingefü hrt. Hierzu wurde erstmals im großen Umfang Lasertechnologie fü r das Bohren von Verbindungen von einer Lage zur nä chsten eingesetzt, wodurch der Platzbedarf fü r die elektrische Verbindungstechnik signifikant reduziert werden konnte. Die Trends in der Miniaturisierung in der Aufbau-und Verbindungstechnik, aber auch die Reduktion der Grö ße von elektrischen und elektronischen Bauteilen wurden im Wesentlichen von der Telekommunikationsbranche geprä gt. Die nä chsten Schritte der Miniaturisierung von elektronischen Aufbauten fü r mobile Endgerä te stellen neue Anforderungen an Integrationstechniken, da neben der Miniaturisierung gleichzeitig eine hö here Leistungsfä higkeit der Systeme notwendig ist. Damit werden neue Anforderungen an funktionale Materialien, Leistungsdichten von immer kleineren Bauteilen und mechanische Leistungsfä hgkeit von Substratmaterialien gestellt. Im Folgenden werden die Komponenten und Prozesse skizziert, die fü r ein elektrisches System auf der Basis der Leiterplattentechnologie realisiert werden mü ssen. Schlü sselwö rter: Leiterplatte; Miniaturisierung; Aufbau-und Verbindungstechnik; Integration von KomponentenThe printed wiring board is turning into an electrial system.The printed wiring board (PWB) and its methods for production have not significantly changed over the last 60 years. The etching of the design into a full layer of copper is still state-of-the-art. The introduction of high density interconnection technology (HDI) at the end of the 1990s was the greatest change concerning the buildup of PWBs. For the first time the use of laser technology was introduced for drilling z-axis connections, which significantly reduced the footprint for electrical interconnections. The trends in miniaturization in assembly technology but also in size reduction of electrical and electronic components were mainly set by the telecommunication industry. The next steps in miniaturization will require new integration technologies, as system performance requirements will simultaneously rise. This results in demand for new functional materials with higher specific performance, size reduction of components and enhanced mechanical durability of substrates. In the following, components and processes are described that need to be developed for an electrical system based on PWB technology.

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“…The main advantages are its good optical properties, the excellent thermal stability, and durability against moisture along with the fact that it can be well structured and used like a negative photoresist. 7,24 The UV-casting process itself can be outlined as follows.…”

Section: On-chip Replication Techniquementioning

confidence: 99%

“…7 This approach provides a cost-effective way to integrate micro-optical elements directly on a VCSEL chip, 8 Fig. 2.…”

Section: Introductionmentioning

confidence: 99%

Chip-level integrated diffractive optical microlenses for multimode vertical-cavity surface-emitting laser to fiber coupling

Ammer¹

2002

Opt. Eng

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The standard assembly technologies for vertical-cavity surface-emitting laser (VCSEL) to fiber coupling systems involve the integration of discrete elements with demanding requirements for alignment effort and time. We present a method for the monolithic integration of diffractive microlenses on the chip level. This process is based on a UV-casting replication technique using ORMOCER ® (a registered trademark of Fraunhofer-Gesellschaft) materials [hybrid organic-inorganic polymers (Streppel et al. 2001)] and offers the capability to be extended to a wafer-scale process. A mathematical description for the propagation of the laser modes through the system and the resulting fiber coupling efficiency is presented. We use a model for the source characteristics of the VCSEL based on a step-index fiber model for the simulation of the mode-field propagation. A model for the estimation of the diffraction efficiency of the lens is developed. Finally the simulations are compared with first experimental results of single replicated elements. Experimental coupling efficiencies for a multimode fiber [50/125, numerical aperture (NA)ϭ0.20] better than 0.7 over the entire operation range of the VCSEL are achieved. Losses below 0.5 dB (10%) are observed within lateral fiber displacement tolerances of Ϯ10 m.

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<title>Multilayer optical fan-out device composed of stacked monomode waveguides</title>

Cited by 7 publications

References 3 publications

<title>Realization of a vertical integration scheme for polymer waveguides by a novel stacking technology</title>

<title>Realization of a vertical integration scheme for polymer waveguides by a novel stacking technology</title>

Die Leiterplatte wandelt sich zum elektrischen System

Chip-level integrated diffractive optical microlenses for multimode vertical-cavity surface-emitting laser to fiber coupling

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