Abstract:We report here the use of automatic die -by -die alignment to overlay 10 :1 wafer-stepper images on patterns delineated by 1:1 proximity and projection systems. The motivation for these programs arises from considerations of cost -effectiveness and productivity while upgrading existing IC fab lines; 1:1 lithographic systems already in place can be used to generate non -critical layers, while the wafer steppers can be used to align and delineate the patterns of critical layers. Excellent intra -die overlay matc… Show more
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