1998
DOI: 10.1117/12.326963
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<title>Machine vision algorithms for semiconductor wafer inspection: a project with Inspex</title>

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Cited by 7 publications
(4 citation statements)
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“…This method is very fast but a major disadvantage is that small defects cannot be recognised. Wavelet technique (Chen et al 1998) has also been involved in wafer inspection. A fairly complete review of the related literature may be found in Babian (1986), Newman et al (1995), Moganti et al (1996Moganti et al ( , 1998aMoganti et al ( , 1998b).…”
Section: Backgroundsmentioning
confidence: 99%
“…This method is very fast but a major disadvantage is that small defects cannot be recognised. Wavelet technique (Chen et al 1998) has also been involved in wafer inspection. A fairly complete review of the related literature may be found in Babian (1986), Newman et al (1995), Moganti et al (1996Moganti et al ( , 1998aMoganti et al ( , 1998b).…”
Section: Backgroundsmentioning
confidence: 99%
“…This method is very fast, but a major disadvantage is that small defects cannot be recognised. Wavelet technique [17] has also been used in wafer inspection. A complete review of the related literature may be found in Babian [2], Newman et al [11], Moganti et al [12], [15] and [16].…”
Section: Introductionmentioning
confidence: 99%
“…Other methods such as optical spatial filtering methods [11], laser scattering methods [18] and wavelet technique [12] have also been involved in wafer inspection. A fairly complete review of the related literature may be found in [13][14][15][16].…”
Section: Introductionmentioning
confidence: 99%