<title>Laser process for personalization and repair of multichip modules</title>

Rapid prototyping of multi-chip modules

“…Since the metallic palladium is resistant to a caustic etchant, the laser-patterned features will define regions of subsequent electroless copper plating once the polymer covering the unirradiated portions of the MCM substrate is removed in an etch step. While we shall confine our discussion here t o this specific laser process, there are other laser processes which might be suitable as well for this application [5]. Figure 3 is a magnified view of several links formed between gold conductors on a multi-level MCM substrate, after the laser patterning and electroless copper plating were performed.…”