1995
DOI: 10.1117/12.210393
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<title>Dielectric and chemical characteristics of electron-beam-cured photoresist</title>

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Cited by 7 publications
(4 citation statements)
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“…Sison et al 28 reported that the crosslinking mechanism in photoresists involve the interaction between the DNQ and the novolak resin, or, interaction of the novolak resin by itself.…”
Section: Resultsmentioning
confidence: 99%
“…Sison et al 28 reported that the crosslinking mechanism in photoresists involve the interaction between the DNQ and the novolak resin, or, interaction of the novolak resin by itself.…”
Section: Resultsmentioning
confidence: 99%
“…Approximate dielectric constants (relative permittivities) used for modeling the media, photoresist, and silicon dioxide were 80, 4, and 4, respectively (Sears et al, 1980;Sison et al, 1995;Murray, 1997), assuming that the media and the photoresist had dielectric constants similar to that of water and other novolac-based positive photoresists, respectively. We assumed permittivity-dominated operation, as justified by both analytical calculations and the existence of the DC-blocking silicon dioxide layer.…”
Section: Modeling and Calculationsmentioning
confidence: 99%
“…The PbI 2 films were prepared on Si/PEDOT:PSS because glass absorbs the IR light. In Figure 6a, characteristic peaks related to the C=O stretching were found around 1715 cm −1 [22]. According to the literature, the C=O vibration shifts to lower frequency around 1650 cm −1 for DMF, which forms Lewis adducts due to the reaction of the PbI 2 layer [23,24].…”
Section: Resultsmentioning
confidence: 99%