Abstract:We developed a novel piezo-driven parallel-kinematics single crystal silicon micropositioning XY stage. This monolithic design features parallelogram four-bar linkages, flexure hinges and piezoelectric stack actuators. The stage is made from single crystal silicon because it has excellent mechanical properties compared to metals, which result in high bandwidth, large work zone and compact size of the stage. Kinematics and dynamics analysis were performed for the design. We also developed microfabrication proce… Show more
“…Different technologies have been used to provide actuation to silicon-based MEMS (micro-electro-mechanical systems) micro positioning systems, including piezoelectricactuators [13], shape memory alloy actuators [14], electromagnetic actuators [7], electro-thermal actuator [15] and electrostatic comb-drive actuators [1-6, 8-12, 16-20]. Among these actuation technologies, electrostatic comb-drive actuators are most commonly used because of their simplicity and the ease with which their fabrication is integrated with that of the rest of the structure.…”
Section: Introductionmentioning
confidence: 99%
“…Parallel kinematic mechanisms, which have been widely used for macro and meso scale positioning systems [13,[20][21][22], can be designed so as to be better suited for siliconbased micro positioners. A parallel kinematic mechanism (PKM) consists of a fixed base and movable end-effector connected in parallel by multiple independent kinematic chains.…”
This paper presents the design, kinematics, fabrication and characterization of a monolithic micro positioning two degree-of-freedom translational (XY) stage. The design of the proposed MEMS (micro-electro-mechanical system) stage is based on a parallel kinematics mechanism (PKM). The stage is fabricated on a silicon-on-insulator (SOI) substrate. The PKM design decouples the motion in the XY directions. The design restricts rotations in the XY plane while allowing for an increased motion range and produces linear kinematics in the operating region (or workspace) of the stage. The truss-like structure of the PKM also results in increased stiffness by reducing the mass of the stage. The stage is fabricated on a silicon-on-insulator (SOI) wafer using surface micromachining and a deep reactive ion etching (DRIE) process. Two sets of electrostatic linear comb drives are used to actuate the stage mechanism in the X and Y directions. The fabricated stage provides a motion range of more than 15 µm in each direction at a driving voltage of 45 V. The resonant frequency of the stage under ambient conditions is 960 Hz. A high Q factor (∼100) is achieved from this parallel kinematics mechanism design.
“…Different technologies have been used to provide actuation to silicon-based MEMS (micro-electro-mechanical systems) micro positioning systems, including piezoelectricactuators [13], shape memory alloy actuators [14], electromagnetic actuators [7], electro-thermal actuator [15] and electrostatic comb-drive actuators [1-6, 8-12, 16-20]. Among these actuation technologies, electrostatic comb-drive actuators are most commonly used because of their simplicity and the ease with which their fabrication is integrated with that of the rest of the structure.…”
Section: Introductionmentioning
confidence: 99%
“…Parallel kinematic mechanisms, which have been widely used for macro and meso scale positioning systems [13,[20][21][22], can be designed so as to be better suited for siliconbased micro positioners. A parallel kinematic mechanism (PKM) consists of a fixed base and movable end-effector connected in parallel by multiple independent kinematic chains.…”
This paper presents the design, kinematics, fabrication and characterization of a monolithic micro positioning two degree-of-freedom translational (XY) stage. The design of the proposed MEMS (micro-electro-mechanical system) stage is based on a parallel kinematics mechanism (PKM). The stage is fabricated on a silicon-on-insulator (SOI) substrate. The PKM design decouples the motion in the XY directions. The design restricts rotations in the XY plane while allowing for an increased motion range and produces linear kinematics in the operating region (or workspace) of the stage. The truss-like structure of the PKM also results in increased stiffness by reducing the mass of the stage. The stage is fabricated on a silicon-on-insulator (SOI) wafer using surface micromachining and a deep reactive ion etching (DRIE) process. Two sets of electrostatic linear comb drives are used to actuate the stage mechanism in the X and Y directions. The fabricated stage provides a motion range of more than 15 µm in each direction at a driving voltage of 45 V. The resonant frequency of the stage under ambient conditions is 960 Hz. A high Q factor (∼100) is achieved from this parallel kinematics mechanism design.
“…Some of the important reasons why MEMS positioners play an important role in nanotechnology are: size, high dynamic range, high resolution of motion or force, and integrated fabrication with other elements of micro-systems. With the latter often being critical consideration in applications that embed MEMS-based nanopositioners, while piezoelectric actuators [11], shape memory alloy actuators [12], electromagnetic actuators, electrothermal actuators [13] have been suggested, electrostatic comb-drive actuators [1]- [10], [14], [15], [16], [17], [18] are most commonly used.…”
Section: Introductionmentioning
confidence: 99%
“…Parallel-kinematics mechanisms, that have been increasingly studied for use in macro and meso-scale positioning systems [11], [24], [26] can be designed so as to be better suited for silicon-based, MEMS-scale micro-and nanopositioners. A parallelkinematics mechanism (PKM) consists of a fixed base and movable end-effector connected in parallel by multiple independent kinematic chains.…”
Micro-and nanopositioning systems are widely used in the field of nanotechnology for probing, imaging, and increasingly for processing. This two-part set of papers presents a MEMS-scale parallel-kinematics mechanism, designed to achieve pure spatial (X, Y and Z) translation. With three independent kinematic chains connecting the end-effector to the base, a fully functional mechanism with axis actuation and displacement sensing is realized in a double device layer ("oreo") SOI wafer using only conventional, microfabrication processes. This paper, the first in a two paper set, presents the mechanism, specially designed for scalable microfabrication. It analyzes its kinematics and dynamics, and characterizes its workspace. Part II of this set of papers describes the detailed design, fabrication, characterization and control of the devices.
“…However, the electrostatic actuator requires several tens of volts for reliable operation. Other types of excitation micro-actuators are based on the piezoelectric effect [2], shape memory alloy [3], the electromagnetic method [4] and electro-thermal mechanisms [5,6]. The fabrication of a piezoelectric actuator requires ultrahigh precision manufacturing with correspondingly high costs [7][8][9][10].…”
This paper describes a novel micro xy-stage, driven by double-hot arm horizontal thermal micro-actuators integrated with a piezoresistive sensor (PS) for low-voltage operation and precise control. This micro xy-stage structure is linked with chevron beams and optimized to amplify the displacement generated by the micro-actuators that provide a pull force to the movable platform. The PS employed for in situ displacement detection and feedback control is fabricated at the base of a cold arm, which minimizes the influence of temperature change induced by electro-thermal heating. The micro xy-stage structure is defined through the use of a simple micromachining process, released by backside wet etching with a special tool. For an input power of approximately 44 mW, each chevron actuator provides about 16 µm and the total displacement of the platform is close to 32 µm. The sensitivity of the PS is better than 1 mV µm−1, obtained from the amplified voltage output of the Wheatstone bridge circuit. The potential applications of the proposed micro xy-stage lie in micro- or nano-manipulation, as well as the positioning of ultra-small objects in nanotechnology.
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