<title>Analytical techniques for examining reliability and failure mechanisms of barrier-coated encapsulated silicon pressure sensors exposed to harsh media</title>

Testing and Standards for Qualification

“…In the automotive application of tire pressure monitoring, of this type of testing is very important [28,29]. In addition, acceleration testing was performed on the Motorola device to determine output changes as a function of tire rotation.…”

“…To add theory to this media study, an electrochemical test method was developed to test the Motorola pressure sensor using impedance spectroscopy and alternate encapsulants [29], with open circuit potential and polarization used to test for adhesion strength and permeability of the encapsulation (see Chapter 4).…”

A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach

“…A variety of packaging techniques for pressure sensor application have been proposed in recent years. In [2][3][4], the pressure sensors were packaged using a two-step process in which a pre-mold plastic host was embedded within a lead frame substrate. However, low throughput and a large packaging volume are not suitable for portable commercial products.…”

Stainless steel capacitive pressure sensor for hostile environments: Sample-to-sample variability and reliability characterization

“…Currently, the most widely implemented solution is a silicon sensor chip packaged in a SS housing with a silicone transfer media and a SS diaphragm [1,2]. The disadvantages with such an implementation include high packaged sensor cost and limited operating temperature range [3]. In addition, recalibration of the sensor after packaging is necessary to characterize input response [1].…”