Lower concentration ultrafine particulates improve the surface properties of metals and alloys

Abstract

This paper discusses the lower concentration reinforcement of cathodic ultrafine ceramic particulates, on metal matrices like Zn, Al and alloy‐matrices like Cu Zn, Cu Mn, Al Zn and Ni‐P‐B alloy‐electrodeposits, etc. It is assumed that these ultrafine ceramic particulates in lower concentration‐range are effective in covering the anodic grain‐boundary networks and other anodic‐defect sites, such that there is an effective reduction of surface anodic‐current. It is shown that at a critical threshold particulate concentration, the surface dissolution is minimum, followed by a drastic increase above that concentration. Such increase in dissolution is attributed to the random dispersion of the particulates on the grain‐proper, as these cannot be accommodated within the anodic grain‐boundary channels, micro‐voids and other defect sites. As such they form stress‐raiser points and enhance surface dissolution. This paper also discusses the correlation of the grain boundary structures, particulate trapping capacity of the matrix and the galvanic stress factors due to random distribution of particulates.