Articles you may be interested inFabrication of high-aspect-ratio double-slot photonic crystal waveguide in InP heterostructure by inductively coupled plasma etching using ultra-low pressure AIP Advances 3, 022122 (2013); 10.1063/1.4793082Characterization of hydrogen silsesquioxane as a Cl 2 ∕ B Cl 3 inductively coupled plasma etch mask for air-clad InP-based quantum well waveguide fabrication Effect of mask thickness on the nanoscale sidewall roughness and optical scattering losses of deep-etched In P ∕ In Ga As P high mesa waveguidesThe effects of etch depth on the sidewall roughness ͑SWR͒ of InGaAsP/InP waveguides fabricated utilizing two types of masks, NiCr/SiO 2 and SiO 2 /NiCr/SiO 2 , were investigated with an atomic force microscopy. All the waveguides were etched in an inductively coupled plasma-reactive ion etching to depths ranging from 4 to 8 m. The root-mean-square ͑rms͒ sidewall roughness values of the waveguides etched to depths of 4, 6, and 8 m with SiO 2 remasking layer were measured to be 2.97, 3.45, and 3.64 nm, respectively. Also the rms SWR values of the waveguides etched without the remasking layer were 3.2, 3.65, and 3.89 nm, respectively. The SiO 2 thin remasking layer deposited on NiCr/SiO 2 mask structure reduced the SWR of the waveguides. Measurements indicated that SWR increased with etch time, which is ascribed to an increase in mask erosion during etching.