Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Stoukatch, Serguei; Fagnard, Jean-François; Dupont, F.; Laurent, Philippe; Debliquy, Marc; Redouté, Jean-Michel

doi:10.1109/access.2022.3151356

Cited by 6 publications

(5 citation statements)

References 24 publications

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“…This thermally insulating adhesive aims to protect the PCB from the heat generated by the sensor, its operational temperature being as high as 250 °C. More details on the sensor and PCB geometry, as well as package construction, can be found in [ 33 ]. The photographs of the CA and WB MOX sensor from frontside, backside, and front-angle view are presented in Figure 1 .…”

Section: Mox Gas Sensor: Package Description and Constructionmentioning

confidence: 99%

“…For its permanent fixation to the PCB, we used an in-house [13] specially formulated thermal interface material (TIM) with a thermal conductivity of 0.108 W m −1 K −1 [32], which comprises 22.7% xerogel by weight. This thermally insulating adhesive aims to protect the PCB from the heat generated by the sensor, its operational temperature being as high as 250 • C. More details on the sensor and PCB geometry, as well as package construction, can be found in [33]. The photographs of the CA and WB MOX sensor from frontside, backside, and front-angle view are presented in Figure 1.…”

Section: Mox Gas Sensor: Package Description and Constructionmentioning

confidence: 99%

“…Sensor die (alumina ceramic) 25 [33] PCB 0.30 [33] Thermal insulating material ( We studied the packaged sensor thermal behavior by applying a steady-state thermal model with conductive heat transfer taken into account in all volumes, including the air (assuming constant thermal properties), and convective and radiative heat transfer taken into account on all external surfaces of the assembly. For h conv and h rad (convective and radiative transfer coefficients, respectively), we used h conv = 20 W K −1 m −2 and h rad = εσ where ε = 0.75 and σ is the Stefan-Boltzmann constant.…”

Section: Materials K (W Kmentioning

confidence: 99%

“…The sensors operate in steady-state at a temperature of 250 °C. As was demonstrated and discussed in detail in [33], because of the different materials (PCB, TIM, ceramic, CA tracks, and WB) of which the packaged sensor is made and their different corresponding emissivities, the temperature readings obtained directly by IR camera must be corrected in order to obtain the actual temperature. In this experiment, we applied the earlier developed procedure for temperature correction to obtain the actual temperature of the specific assembly parts.…”

Section: Modeling Validationmentioning

confidence: 99%

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Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization

Stoukatch,

Dupont,

Laurent

et al. 2023

Materials

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We designed a 3D geometrical model of a metal-oxide gas sensor and its custom packaging and used it in finite element modeling (FEM) analysis for obtaining temperature and heat flux distribution. The 3D computer simulation, performed with GetDP software (version 3.5.0, 13 May 2022), accurately predicted the temperature distribution variation across the entire assembly. Knowing the temperature variation and the location of the hot spots allowed us to select the best electrical interconnect method and to choose the optimal materials combination and optimal geometry. The thermal modeling also confirmed the need to use a low thermal conductivity material to insulate the MOX sensor since the latter is heated to its operational temperature of 250 °C. For that purpose, we used the in-house formulated xerogel–epoxy composite of thermal conductivity of 0.108 W m−1 K−1, which is at least 30% less compared to the best-in-class among commercially available materials. Based on the 3D FEM outputs, we designed, assembled, and characterized a fully functional packaged MOX gas sensor in several configurations. We measured the temperature distribution on all parts of the MOX gas sensor assembly using a thermal imaging infrared (IR) microscope. The results of 3D FEM are in good agreement with the temperature distribution obtained by the non-contact IR thermal characterization.

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Section: Mox Gas Sensor: Package Description and Constructionmentioning

confidence: 99%

Section: Mox Gas Sensor: Package Description and Constructionmentioning

confidence: 99%

Section: Materials K (W Kmentioning

confidence: 99%

Section: Modeling Validationmentioning

confidence: 99%

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Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization

Stoukatch,

Dupont,

Laurent

et al. 2023

Materials

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“…To go from concept to practical implementation, we need to design a packaging solution for the pH sensor. Unlike integrated circuit (IC) packaging, there is no uniform packaging solution for a wide range of sensors [19], including pH sensors. The sensors' specificity dictates a specific requirement for the corresponding package.…”

Section: Concept and Architecture Of The Optical Ph Sensormentioning

confidence: 99%

Low-Cost Optical pH Sensor with a Polyaniline (PANI)-Sensitive Layer Based on Commercial Off-the-Shelf (COTS) Components

Stoukatch,

Debliquy,

Dupont

et al. 2023

Micromachines

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In this paper, we presented a novel, compact, conceptually simple, and fully functional low-cost prototype of a pH sensor with a PANI thin film as a sensing layer. The PANI deposition process is truly low-cost; it performs from the liquid phase, does not required any specialized equipment, and comprises few processing steps. The resulting PANI layer has excellent stability, resistance to solvents, and bio- and chemical compatibility. The pH sensor’s sensing part includes only a few components such as a red-light-emitting diode (LED) as a light source, and a corresponding photodiode (PD) as a detector. Unlike other PANI-based sensors, it requires no sophisticated and expensive techniques and components such lasers to excite the PANI or spectrometry to identify the PANI color change induced by pH variation. The pH sensor is sensitive in the broad pH range of 3 to 9, which is useful for numerous practical applications. The sensor requires a tiny volume of the test specimen, as little as 55 µL. We developed a fully integrated packaging solution for the pH sensor that comprises a limited number of components. The pH sensor comprises exclusively commercial off-the-shelf (COTS) components and standard printed circuit boards. The pH sensor is assembled using standard surface mounting technology (SMT).

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Thermal conductivity and shear strength characterisation of hybrid GNPs and silane functionalised BN as thermal conductive adhesive

Jasmee

Ramli

Othaman

et al. 2022

The Journal of Adhesion

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Low Thermal Conductivity Adhesive as a Key Enabler for Compact, Low-Cost Packaging for Metal-Oxide Gas Sensors

Abstract: The work was supported by the Microsystème_ULg Microsys project, funded by the Wallonia (Belgium), and the Micro+ project (No. 675781-642409) cofunded by the European Regional Development Fund (ERDF) and Wallonia (Belgium).

Cited by 6 publications

References 24 publications

Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization

Package Design Thermal Optimization for Metal-Oxide Gas Sensors by Finite Element Modeling and Infra-Red Imaging Characterization

Low-Cost Optical pH Sensor with a Polyaniline (PANI)-Sensitive Layer Based on Commercial Off-the-Shelf (COTS) Components

Thermal conductivity and shear strength characterisation of hybrid GNPs and silane functionalised BN as thermal conductive adhesive

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