The BICMOS technology which integrates the CMOS technology with bipolar technology has drawn considerable attention as an attractive VLSI technology because of the high speed performance and low power consumption of the BICMOS. However, continued down scaling of CMOS devices has caused increased concerns with problems such as latch up, hot carriers and short channel effect. Most of the above mentioned problems can be avoided by operating the CMOS at liquid-nitrogen temperature(LNT). At low-temperatures, the CMOS exhibits lower sub threshold leakage, higher carrier mobility (which yields improved speed performance), and a steeper logarithmic currentvoltage slope. On the other hand, the low-temperature operation of conventional silicon bipolar circuits has been generally dismissed as impractical because of the well known decrease in the current gain at low temperature. The present interest in integrated bipolar-CMOS circuits, plus the prospect of increased reliability, lower wiring delay, and lower noise, has revised interest in low-temperature bipolar devices. In this context, it is therefore important to acquire accurate knowledge of the transistor properties at liquid nitrogen temperature. This can be done in two ways. One is through experimental lowtemperature measurements and the other by low-temperature device simulations.