2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024
DOI: 10.1109/icept63120.2024.10668437
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Low-temperature Thermal Shock Simulation and Life Aging Test of Indium Flip-chip Interconnection Using Liquid Helium for Superconducting Integrated Circuit Package

Haijian Zhao,
Gaowei Xu,
Kun Li
et al.
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