2017
DOI: 10.13168/cs.2017.0040
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LOW-TEMPERATURE SINTERING OF ZnO-Bi₂O₃-BASED VARISTOR CERAMICS FOR ENHANCED MICROSTRUCTURE DEVELOPMENT AND CURRENT-VOLTAGE CHARACTERISTICS

Abstract: ZnO-Bi

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Cited by 8 publications
(8 citation statements)
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“…A high breakdown field is crucial for ZnO based varistor ceramics to meet the miniaturization requirement of electronic equipment and high transmission voltage of power systems [4]. Many other sintering processes, such as liquid-phase sintering [5], microwave sintering [6,7], and spark plasma sintering (SPS) [8] were developed to decrease the sintering temperature and improve the electrical properties of ZnO varistors. Via these sintering techniques, the breakdown field could be enhanced to around 1100 V/mm with  of around 30.…”
Section: Introductionmentioning
confidence: 99%
“…A high breakdown field is crucial for ZnO based varistor ceramics to meet the miniaturization requirement of electronic equipment and high transmission voltage of power systems [4]. Many other sintering processes, such as liquid-phase sintering [5], microwave sintering [6,7], and spark plasma sintering (SPS) [8] were developed to decrease the sintering temperature and improve the electrical properties of ZnO varistors. Via these sintering techniques, the breakdown field could be enhanced to around 1100 V/mm with  of around 30.…”
Section: Introductionmentioning
confidence: 99%
“…新的V o , 这是因为在ZnO中锌填隙缺陷形成焓要 低于氧空位缺陷形成焓, 且氧化锌中锌原子的原子 半径低于氧原子 [15] , 所以在ZnO表面更容易形成 变, 这也是导致ZnO压敏阀片老化的原因之一 [21,22] .…”
Section: 结果与讨论unclassified
“…界面之间结合的强弱对材料的宏观性能有重 要的影响 [22] 的阻值急剧下降的现象 [22,23] . 在这一区域中的伏安 体系的击穿场强在0.15 V/Å附近, 一般ZnO压敏 陶瓷单晶界击穿电压为2.5-3.6 V之间 [24] , 通过 TEM观察到非晶区晶界宽度为1-2 nm [14] , 因此 可求得实际单晶界击穿场强在0.12-0.36 V/Å之 间, 进一步说明本文所构建的界面模型能够较好地 反映实际ZnO压敏阀片的内部微观结构.…”
Section: 结果与讨论unclassified
“…Up to date, several researches have shown the relationship between sintering temperature and how it affects the densification of ceramic varistor. Such example includes decreasing in sintering temperature cause an increase in pores, which directly decrease the density and vice versa [8,30,31]. The truth is each material has its own properties that cause this kind of situation to happen.…”
Section: Densificationmentioning
confidence: 99%