Low temperature passivation of silicon surfaces for enhanced performance of Schottky-barrier MOSFET

Abstract

By using a simple device architecture along with a simple process design and a low thermal-budget of a maximum of 100 °C for passivating metal/semiconductor interfaces, a Schottky barrier MOSFET device with a low subthreshold slope of 70 mV dec−1 could be developed. This device is enabled after passivation of the metal/silicon interface (found at the source/drain regions) with ultra-thin SiO x films, followed by the e-beam evaporation of high- quality aluminum and by using atomic-layer deposition for HfO2 as a gate oxide. All of these fabrication steps were designed in a sequential process so that a gate-last recipe could minimize the defect density at the aluminum/silicon and HfO2/silicon interfaces, thus preserving the Schottky barrier height and ultimately, the outstanding performance of the transistor. This device is fully integrated into silicon after standard CMOS-compatible processing, so that it could be easily adopted into front-end-of-line or even in back-end-of-line stages of an integrated circuit, where low thermal budget is required and where its functionality could be increased by developing additional and fast logic.