Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications

Kwon, Jinhyeong; Cho, Hyunmin; Eom, Hyo J.; Lee, Habeom; Suh, Yong-Suk; Moon, Hee‐Jong; Shin, Jaeho; Hong, Sukjoon; Ko, Seung Hwan

doi:10.1021/acsami.5b12714

Cited by 166 publications

(85 citation statements)

References 41 publications

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“…For example, at low scanning speed, Cu structure was partially or sometimes completely detached from the substrate due to the high power applied and the subsequent excessive thermal stress. Laser sintering can also be used as a tool to fabricate conductive metal grid . After washing away the non‐laser‐irradiated AgNPs or CuNPs with deionized water shower, transparent conductive Ag and Cu grid patterns were formed.…”

Section: Post‐printing Treatmentmentioning

confidence: 99%

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Huang

Zhu

2019

Adv Materials Technologies

344

347

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PE has been explored for the manufacturing of flexible and stretchable electronic devices by printing functional inks containing soluble or dispersed materials, [14][15][16] which has enabled a wide variety of applications, such as transparent conductive films (TCFs), flexible energy harvesting and storage, thin film transistors (TFTs), electroluminescent devices, and wearable sensors. [17][18][19][20][21][22][23][24] The global PE market should reach $26.6 billion by 2022 from $14.0 billion in 2017 at a compound annual growth rate of 13.6%. [25] PE devices are manufactured by a variety of printing technologies. Typical printing technologies can be divided into two broad categories: noncontact patterning (or nozzle-based patterning) and contact-based patterning. The noncontact techniques include inkjet printing, electrohydrodynamic (EHD) printing, aerosol jet printing, and slot die coating, while screen printing, gravure printing, and flexographic printing are examples of the contact techniques. Each of these techniques has its own advantages and disadvantages, but they all rely on the principle of transferring inks to a substrate. Understanding the characteristics and recent advances of each printing technique is important to further the progress in PE. Moreover, to promote the lab-scale printing technologies to large-scale production process, roll-toroll (R2R) printing, which is one of the manufacturing methods to obtain large-area films with low cost and excellent durability, has drawn much attention from both industry and the research community.Nearly all of devices based on PE require conductive structures, interconnects, and contacts; therefore, highly conductive patterns, usually with high transparency and/or high resolution, fabricated by means of printing conductive materials are one of the most critical components in PE devices. Various printable conductive nanomaterials, such as metal nanomaterials (e.g., metal nanoparticles and metal nanowires) and carbon nanomaterials (e.g., graphene and carbon nanotubes (CNTs)), have been explored and used as major materials for PE. Applying printing technology to deposition of the conductive nanomaterials requires formulation of suitable inks. After depositing inks on different substrates, post-printing treatment, Printed electronics is attracting a great deal of attention in both research and commercialization as it enables fabrication of large-scale, low-cost electronic devices on a variety of substrates. Printed electronics plays a critical role infacilitating widespread flexible electronics and more recently stretchable electronics. Conductive nanomaterials, such as metal nanoparticles and nanowires, carbon nanotubes, and graphene, are promising building blocks for printed electronics. Nanomaterial-based printing technologies, formulation of printable inks, post-printing treatment, and integration of functional devices have progressed substantially in the recent years. This review summarizes basic principles and recent development of common printing technologie...

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Section: Post‐printing Treatmentmentioning

confidence: 99%

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Huang

Zhu

2019

Adv Materials Technologies

344

347

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“…At the first stage (30–90 °C), the weight of the tested sample is rapidly decreasing and heat flow is declined as the liquid contents (methanol and butyl acetate) evaporate off the Zn NPs. In the second stage (120–170 °C), the PVP layer is thermally degraded, followed by sintering of Zn NPs in the third stage (≈40–800 °C). The sample shows slight weight gain (≈3 w%), which may be attributed to the oxidation of Zn NPs during the process of PVP degradation and particle sintering.…”

Section: Resultsmentioning

confidence: 99%

Mechanically Milled Irregular Zinc Nanoparticles for Printable Bioresorbable Electronics

Mahajan

Shou

et al. 2017

Small

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Bioresorbable electronics is predominantly realized by complex and time-consuming anhydrous fabrication processes. New technology explores printable methods using inks containing micro- or nano-bioresorbable particles (e.g., Zn and Mg). However, these particles have seldom been obtained in the context of bioresorbable electronics using cheap, reliable, and effective approaches with limited study on properties essential to printable electronics. Here, irregular nanocrystalline Zn with controllable sizes and optimized electrical performance is obtained through ball milling approach using polyvinylpyrrolidone (PVP) as a process control agent to stabilize Zn particles and prevent cold welding. Time and PVP dependence of the ball milled particles are studied with systematic characterizations of morphology and composition of the nanoparticles. The results reveal crystallized Zn nanoparticles with a size of ≈34.834 ± 1.76 nm and low surface oxidation. The resulting Zn nanoparticles can be readily printed onto bioresorbable substrates and sintered at room temperature using a photonic sintering approach, leading to a high conductivity of 44 643 S m for printable zinc nanoparticles. The techniques to obtain Zn nanoparticles through ball milling and processing them through photonic sintering may potentially lead to a mass fabrication method for bioresorbable electronics and promote its applications in healthcare, environmental protection, and consumer electronics.

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“…Moreover, since the laser parameters are highly controllable, the SLS process was confirmed to be applicable to the creation of a metal layer on flexible substrates which are sensitive to heat. The SLS process was first applied to noble metal NPs such as gold (Au) [8] and silver (Ag) [9,10], but the range of applicable NPs is being expanded to include more cost-effective materials such as copper (Cu) [11,12] and nickel (Ni) [13,14] through the reductive sintering process.…”

Section: Introductionmentioning

confidence: 99%

Continuous-Wave Laser-Induced Transfer of Metal Nanoparticles to Arbitrary Polymer Substrates

et al. 2020

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Laser-induced forward transfer (LIFT) and selective laser sintering (SLS) are two distinct laser processes that can be applied to metal nanoparticle (NP) ink for the fabrication of a conductive layer on various substrates. A pulsed laser and a continuous-wave (CW) laser are utilized respectively in the conventional LIFT and SLS processes; however, in this study, CW laser-induced transfer of the metal NP is proposed to achieve simultaneous sintering and transfer of the metal NP to a wide range of polymer substrates. At the optimum laser parameters, it was shown that a high-quality uniform metal conductor was created on the acceptor substrate while the metal NP was sharply detached from the donor substrate, and we anticipate that such an asymmetric transfer phenomenon is related to the difference in the adhesion strengths. The resultant metal electrode exhibits a low resistivity that is comparable to its bulk counterpart, together with strong adhesion to the target polymer substrate. The versatility of the proposed process in terms of the target substrate and applicable metal NPs brightens its prospects as a facile manufacturing scheme for flexible electronics.

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Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications

Cited by 166 publications

References 41 publications

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications

Mechanically Milled Irregular Zinc Nanoparticles for Printable Bioresorbable Electronics

Continuous-Wave Laser-Induced Transfer of Metal Nanoparticles to Arbitrary Polymer Substrates

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