Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers

Yonezawa, Tetsu; Tsukamoto, Hiroki; Matsubara, Masaki

doi:10.1039/c5ra06599b

Cited by 33 publications

(33 citation statements)

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“…In general, the use of a higher sintering temperature is required for the removal of the organic layers. [9][10][11] In this work, to exploit the use of smaller Cu particles with a wide size distribution and to avoid the use of high sintering temperatures for the removal of the organic stabilizers, an amino-induced decomposable polymer, PPC, was selected as a capping agent for the fine Cu particles. PPC is a biodegradable and biocompatible polymer.…”

Section: Merits Of Ppc-stabilized Fine Cu Particles and Cu Film Formamentioning

confidence: 99%

“…Fine Cu particles and nanoparticles 8 are stabilized using surfactants to prevent their oxidation. [9][10][11] Such stabilizers, which function as barriers, hinder the percolation paths of the Cu particles. This results in the production of printed patterns with high resistivity which are unsuitable for practical applications.…”

Section: Introductionmentioning

confidence: 99%

“…Conventionally, in order to overcome this problem and to produce materials with good conductivity, high-temperature sintering (at 200 1C or higher) is performed using an oven under a designed atmosphere. 2,[9][10][11] However, a much lower sintering temperature is necessary in the case of flexible and low-cost electronic devices that use heatsensitive substrates, such as paper and polymeric substrates (e.g., poly(ethylene terephthalate) (PET), polycarbonate (PC), polyethylene naphthalate (PEN)). Also, a low temperature sintering is indispensable for organic electronic assemblies.…”

Section: Introductionmentioning

confidence: 99%

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Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

et al. 2017

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A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2- propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 degrees C. Following sintering at a temperature of 100 degrees C, the lowest reported resistivity (8.8 x 10(-7) Omega m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex

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Section: Merits Of Ppc-stabilized Fine Cu Particles and Cu Film Formamentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

et al. 2017

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“…Copper inks and pastes, which have a lower cost, excellent electrical resistivity (1.7 × 10 −8 Ω·m which is similar to silver) and higher electro-migration resistance, have attracted significant interest13141516171819202122. Copper has a much lower price (approximately 2.6 USD/lb) than silver (approximately 17 USD/ounce)23.…”

mentioning

confidence: 99%

“…There are two types of copper inks being used22. One type is a suspension or dispersion of fine copper particles or nanoparticles1415161718192021. The other type is the copper-based metal-organic decomposition (MOD) ink, which is composed of a copper salt, amine/amino hydroxyl ligands and other organic components22425262728.…”

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confidence: 99%

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Yong

Nguyen

Tsukamoto

et al. 2017

Sci Rep

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Mixtures of a copper complex and copper fine particles as copper-based metal-organic decomposition (MOD) dispersions have been demonstrated to be effective for low-temperature sintering of conductive copper film. However, the copper particle size effect on decomposition process of the dispersion during heating and the effect of organic residues on the resistivity have not been studied. In this study, the decomposition process of dispersions containing mixtures of a copper complex and copper particles with various sizes was studied. The effect of organic residues on the resistivity was also studied using thermogravimetric analysis. In addition, the choice of copper salts in the copper complex was also discussed. In this work, a low-resistivity sintered copper film (7 × 10−6 Ω·m) at a temperature as low as 100 °C was achieved without using any reductive gas.

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Droplet‐Based Techniques for Printing of Functional Inks for Flexible Physical Sensors

2021

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Printing processes can be broadly classified into "contact" and "non-contact" printing. In contact printing, the ink is transferred directly from a patterned medium (engraved roller or stencil) onto a substrate, while in non-contact printing the ink droplets are ejected from a series of nozzles on the intended surface. [9] Offset, flexography, gravure, and screen printing are among the most common contact printing methods, while jet-printing processes constitute noncontact counterpart. Jet-printing involves a series of computer-controlled pattern reproduction techniques, which can be subdivided into inkjet, aerosol-jet, and electrohydrodynamic-jet printing. In these techniques, the ink is deposited in the form of droplets hence named "droplet-based" printing. Inkjet is a wellestablished technology, which is now finding its way in to industries, [10] while aerosol jet is a relatively new technology developed for printing on non-planar substrates. The first prototype of electrohydrodynamic jet printing was patented for graphical patterning, but later on altered for high-resolution electronic printing in nanometer scale. [11] Flexible physical sensors fabricated by printing techniques are revolutionizing healthcare sector by befitting portable health watching and remote medical solutions. [12] These devices not only enable long-term tracking of physiological signals, but also enormously assist in delocalization of medical services from hospitals to homes. Flexible physical biosensors are widely used to record various biophysical signals such as pulse rate, body temperature, vocal fold vibrations, skeletal muscle contractions, closure of heart valves, breath rate, and movements in the gastrointestinal tract. [13] However current devices fabricated by printing techniques, suffer from low sensitivity and poor repeatability, therefore there is room for huge improvement in this field through specially formulated inks and printing process control. [14] Herein, we present a comprehensive discussion on basics of droplet-based printing techniques (inkjet, aerosol jet, and electrohydrodynamic jet), followed by an in-depth review of metal, carbon, polymer, and ceramic functional inks. We also delve into various post-processing (sintering) methods used to enable flexible devices on substrates with low thermal resistance. The field of flexible devices is vast, and the focus of this paper is on flexible physical sensors fabricated through droplet-based Printed electronics (PE) is an emerging technology that uses functional inks to print electrical components and circuits on variety of substrates. This technology has opened up new possibilities to fabricate flexible, bendable, and form-fitting devices at low-cost and fast speed. There are different printing technologies in use, among which droplet-based techniques are of great interest as they provide the possibility of printing computer-controlled design patterns with high resolution, and greater production flexibility. Nanomaterial inks form the heart of this technology, enablin...

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Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layers

Cited by 33 publications

References 50 publications

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Droplet‐Based Techniques for Printing of Functional Inks for Flexible Physical Sensors

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