Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

“…This results in slowing down the growth of IMCs. Sun [ 35 ] et al used electrochemical methods to obtain Cu–Co–P microcone structures up to 5 μm with sharp top corners. They were pressed together with tin-based solder at 170 °C.…”