In‐rich alloys of InxGa1–xN are becoming highly sought after because of the significant role they may play in a number of technologies including photovoltaics, solid‐state lighting, and high frequency electronics. Unfortunately, these alloys are difficult to produce with high quality by conventional growth technologies. We describe our efforts to create high‐quality In‐rich InxGa1–xN alloys by a new growth technology called energetic neutral atom beam lithography & epitaxy (ENABLE). ENABLE uses a collimated beam of neutral N atoms (kinetic energies of ∼2.0 eV) as the reactive group V species in InxGa1–xN growth, allowing for a substantial reduction in substrate growth temperatures (typically 450 °C to 750 °C). Directly providing a significant portion of the required reaction energy by the N atoms rather than by high substrate temperatures improves InxGa1–xN film quality across the full stoichiometric range. ENABLE‐grown InN on sapphire is shown to be highly crystalline by XRD and RBS. The observed photoluminescence (PL) peak energy is 0.74 eV, and the electron concentrations are between 7x1018 and 7x1019 cm–3 with the highest mobility exceeding 1200 cm2/Vs. ENABLE has been used to produce highly luminescent InxGa1–xN with PL peak energies in the 1.5 to 2.5 eV range, spanning the visible range. ENABLE grown InxGa1–xN films are shown by XRD to be highly crystalline consisting of a uniform single phase. These results establish ENABLE as a new technique uniquely capable of low temperature growth of high‐quality InxGa1–xN films over widely varying compositions. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)