Low Temperature Formation of SAC-SnBi BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)

Taneja, Divya; Danavitch, David; Kanso, Malak; Langlois, Richard N.; Boyer, Nicolas; Dalpe, Eric

doi:10.1109/ectc51906.2022.00188

Cited by 2 publications

(1 citation statement)

References 13 publications

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“…Meanwhile, it increases the plasticity of eutectic SnBi phase and reduces the brittleness of SnBi, thus enhancing the reliability of solder joints (Liu et al , 2017). Different composite structures, different proportions of solder alloys, and different reflow processes all affect the microstructure and properties of composite solder joints (Taneja et al , 2022; Shen et al , 2019). Liu et al (2019) prepared SnBi/SnAgCu/Cu stacked solder joints using a two-step soldering method.…”

Section: Introductionmentioning

confidence: 99%

Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints

Jiang,

Liu,

Xue

et al. 2024

SSMT

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Purpose This paper aims to systematically study the effects of reflow temperature and SAC0307 (SAC) content on the micromorphology and mechanical properties of Sn58Bi-xSAC0307 composite solder joints to meet the requirements of high integration and low-temperature packaging of devices and provide references for the application of composite solder joints. Design/methodology/approach Sn58Bi and SAC0307 solder paste was mechanically mixed in different proportions to prepare Sn58Bi-xSAC0307/ENIG solder joints. The thermal properties, microstructure and mechanical properties of the composite solder joints were studied. Findings As SAC content in the solder increases, the balling temperature of SnBi-SAC solder gradually increases. The addition of SAC alloy reduces the grain size of large Bi-rich phase, and there are small-sized dispersed Bi and Ag3Sn particles in the bulk solder. The intermetallic compounds composition of the SnBi-xSAC/ENIG solder joint changes from Ni3Sn4 to (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 with SAC increasing. As the soldering temperature increases, the strength of all solder joints shows a rising trend. Among them, the shear strength of SnBi-20SAC solder joints at a reflow temperature of 150°C is approximately 37 MPa. As the reflow temperature increases to 250°C, the shear strength of solder joints increases to approximately 67 MPa. Originality/value This study provides a reference for the optimization of low-temperature solder composition and soldering process under different package designs.

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