Low temperature electrochemical deposition of highly active elements

Abstract

Electrochemical methods are attractive for thin film deposition due to their simplicity, conformal and high rate deposition, the ability to easily make multilayers of different composition, ease of scale-up to large surface areas, and applicability to wide variety of different shapes and surface geometries. However, many elements from periodic table of commercial importance are too active to be electrodeposited from aqueous solution. Recent advances are briefly reviewed for room temperature methods for electrochemical deposition, including electrodeposition from ionic liquids, electrodeposition from organic solvents, combined electrodeposition and precipitation on liquid metal cathodes, and galvanic deposition. Recent studies of electrodeposition from ionic liquids include deposition of thick (40 µm) Al coatings on high-strength steel screws in a manufacturing environment; deposition of continuous Si, Ta and Nb coatings; and numerous interesting mechanistic studies. Recent studies of electrodeposition from organic solvents include Al coatings from the AlCl3-dimethylsulfone electrolyte, which demonstrate that additives can be employed to suppress impurity incorporation and to improve the deposit quality, and thick (5-7 µm) and continuous Si coatings from SiCl4 in acetonitrile. Galvanic deposition of Ti, Mo and Si coatings onto Al alloys has recently been reported, which is potentially much simpler and less expensive than electrodeposition from ionic liquids and organic solvents, but has complications associated with substrate consumption and coating adhesion.

Cu/Ni/Au multilayers by electrochemistry: A crucial system in electronics - A critical review

“…Although Cu/Ni/Au multi-layer films are vital systems in electronics, there are only a few books [40,41] explaining them, and they were published over a decade ago. Moreover, the existing reviews [6,[42][43][44][45] about the deposition of metals are either too old or just partially cover this subject. We found no literature review regarding the strategies for increasing the performance and lifetime of Cu/Ni/Au systems.…”

“…Their difference comes from the source of the electron transfer. While ED uses an external power source, EL uses a reducing agent in the bath to provide the required electrons [6]. [6].…”

Selective Preconcentration of Trace Amounts of Cu(II) With Surface‐Imprinted Multiwalled Carbon Nanotubes

“…For this purpose, especially for determining low concentrations, a separation or preconcentration technique is required. There are several separation/ preconcentration techniques for removal or detection of heavy metals; solid-phase extraction (SPE), [1,[6][7][8] liquid-liquid extraction, [9,10] ion-exchange, [11][12][13] co-precipitation, [14,15] electrochemical deposition, [16] cloud point extraction, [17,18] membrane filtration, [19,20] and flotation. [21,22] Solid phase extraction (SPE) is the most used technique due to its many advantages such as lower solvent use, low disposal costs, short extraction times, high efficiency, being safe for the environment, using less glassware, isolation of analytes from large sample volumes resulting with less or minimal evaporation losses, reduced exposure of the researchers to organic solvents and more consistent results over other separation techniques.…”

Improving the corrosion properties of amorphous Ni-P thin films using different additives

“…In this paper, the effect of different additives has been investigated and compared 33 for thin Ni-P layers formed on copper, which is especially interesting for Electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization 3 tests were employed to determine the corrosion properties of the obtained Ni-P films 4 in the absence and presence of different concentrations of the mentioned additives.…”

“…However, coatings with P contents 3 higher than 8% present usually an amorphous structure [14]. Given that the P content 4 largely determines the properties of Ni-P coatings shows the importance of the 5 chemical composition of the electrodeposition bath. it is well known that 6 introducing even a small amount of certain compounds as additives to the electrolyte 7 significantly affects the properties and appearance of deposits [24].…”