2010
DOI: 10.1007/s12666-010-0130-x
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Low temperature diffusion bonding of stainless steel

Abstract: Diffusion bonding of stainless steel (SS) has been attempted in temperature range of 623 -773 K using multiple inter-layers of nickel, copper and silver. The intermediate layers were electro-deposited taking care to avoid oxidation at the interfaces. The bonded area was examined for the formation of any intermetallic compound through electron probe micro-analyzer (EPMA) and nano-indentation technique. Results indicate the absence of brittle intermetallics at the interfaces and the strength of the bonding was f… Show more

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Cited by 15 publications
(8 citation statements)
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References 11 publications
(14 reference statements)
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“…Table 2 provides a brief overview of similar diffusion bonding and TLP bonding studies of 304 stainless steel. Gawde et al [103] used five interlayers (set-up: 304/Ni/Cu/Ag/Cu/Ni/304) to bond 304 stainless steel rods at a relatively low temperature of 500 °C and very low pressure of 0.1 MPa, that was basically just used to keep the set-up in place. Despite the low bonding temperature and pressure the bonded samples reached tensile strength of 130 MPa before they would rupture at the Ag interface (UTS-Ag = 140 MPa) indicating incomplete diffusion of the interlayer into the base material.…”
Section: Diffusion Bonding and Tlp Bonding Of 304 (Similar Joints)mentioning
confidence: 99%
“…Table 2 provides a brief overview of similar diffusion bonding and TLP bonding studies of 304 stainless steel. Gawde et al [103] used five interlayers (set-up: 304/Ni/Cu/Ag/Cu/Ni/304) to bond 304 stainless steel rods at a relatively low temperature of 500 °C and very low pressure of 0.1 MPa, that was basically just used to keep the set-up in place. Despite the low bonding temperature and pressure the bonded samples reached tensile strength of 130 MPa before they would rupture at the Ag interface (UTS-Ag = 140 MPa) indicating incomplete diffusion of the interlayer into the base material.…”
Section: Diffusion Bonding and Tlp Bonding Of 304 (Similar Joints)mentioning
confidence: 99%
“…According to the binary phase diagrams, Mn and Ni can completely soluble in Cu. 10) The addition of Mn and Ni can improve the strength of Cu-based filler metals. However, the addition of Ni can increase the melting point of filler metals and result in the increase of brazing temperature.…”
Section: Introductionmentioning
confidence: 99%
“…The challenge of joining comes due to difference in chemical, physical properties as well as low solubility of iron in aluminum. Different means have been used to join this combination such as magnetic pressure steam welding [8], diffusion bonding [9] ultrasonic welding [10] but all have some limitations and to circumvent this, explosive welding was adopted due to the advancement of joining any material combination with all size in a very few micro seconds. In this research work, aluminum is claded with mild steel and their behavior at interface is studied through micro-hardness & micro-structural analysis by preparing specimen with standard dimensions.…”
Section: Introductionmentioning
confidence: 99%