Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

Sui, Yuying; Li, Jinhui; Wang, Tao; Sun, Deliang; Huang, Chao; Zhang, Fan; Shan, Liang; Niu, Fangfang; Zhang, Guoping; Sun, Rong

doi:10.1016/j.polymer.2021.123514

Cited by 22 publications

(19 citation statements)

References 34 publications

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“…Aromatic polyimide films have been widely used in many high-tech fields, including electrical insulation [ 15 , 16 , 17 , 18 , 19 , 20 ], electronic packaging [ 21 , 22 ], and aerospace [ 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 ], due to their excellent combination of thermal, mechanical, and electrical properties. Aromatic polyimide films can be made by casting the polyimide precursor solution–polyamic acid (PAA) on the substrate surface, and then thermally baking it to form a self-supporting gelled film.…”

Section: Aromatic Polyimide Filmsmentioning

confidence: 99%

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Yang

et al. 2022

Polymers

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Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber composites, engineering plastics, foams, porous membranes, coatings, etc. Aromatic polyimide materials have found widespread use in a variety of high-tech domains, including electric insulating, microelectronics and optoelectronics, aerospace and aviation industries, and so on, due to their superior combination characteristics and variable processability. In recent years, there have been many publications on aromatic polyimide materials, including several books available to readers. In this review, the representative progress in aromatic polyimide films for electronic applications, especially in our laboratory, will be described.

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Section: Aromatic Polyimide Filmsmentioning

confidence: 99%

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Yang

et al. 2022

Polymers

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“…Sui, Y.Y. [ 26 ] found that the curing temperature of PAA could be reduced to 200 °C catalyzed by 5-aminobenzimidazole as an active curing catalyst. Although the imidization of PAA can be catalyzed by heteroaromatic bases, there are few reports on the imidization of PAE, which is usually used in n-PSPIs [ 27 , 28 , 29 ].…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties

et al. 2023

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Low-temperature curable negative-tone photosensitive polyimide (n-LTPI) viscous solutions were prepared by dissolving photo-crosslinkable poly (amic ester) (pc-PAE) resin, photophotocrosslinker, photoinitiator, and the heteroaromatic base as curing catalysts, and other additives in organic solvents. Among them, the pc-PAE resin was synthesized by polycondensation of aromatic diacid chloride and diester of 2-ethoxymathacrylate, aromatic diamines in aprotic solvents. After being spun-coated on a silicon wafer surface, soft-baked, exposed to UV light, and developed, the n-LTPI with 2% of imidazole (IMZ) as a curing catalyst produced high-quality photo-patterns with line via resolution of 5 μm at 5 μm film thickness. The photo-patterned polymer films thermally cured at 230 °C/2 h in nitrogen showed 100% of the imidization degree (ID) determined by in situ FT-IR spectroscopy. The thermally cured polymer films exhibited great combined mechanical and thermal properties, including mechanical properties with tensile strength of as high as 189.0 MPa, tensile modulus of 3.7 GP, and elongation at breakage of 59.2%, as well as glass transition temperature of 282.0 °C, showing great potential in advanced microelectronic packaging applications.

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“…Although low-temperature curing was successfully achieved, the large amount addition of the low-temperature curing accelerators would result in a risk of volatilization in the imidization and the usage which should be completed avoided in the semiconductor industry. Then, Yuying Sui et al [27]. prepared the low temperature cured polyimide by introducing a 5-aminobenzimidazole through covalent bonding with PI chains.…”

Section: Introductionmentioning

confidence: 99%

In-situ polymerization of low-dielectric fluorinated nano carbon/polyimide composites with low-temperature curable property

Zhang

Sui

et al. 2022

Preprint

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One challenge in advanced dielectric material of polyimides (PIs) is to obtain the excellent mechanical, thermal, and dielectric properties at low imidization temperature for fan-out wafer level package in 5G high-frequency communication. In this work, 6-aminoquinoline (AQL) is introduced through covalent bonds to obtain a low-temperature curable PI at first. The results demonstrate that with few addition (2.76%) of AQL, the imidization index could reach as high as 1.01 at 200 oC. Then, fluorinated nano carbon (FC) is further introduced by in situ polymerization resulting in the fluorinated nano carbon/polyimide (FCPI) composites, which effectively reduces the dielectric constant (1wt%, 2.75 @ 1MHz). Besides, the as-prepared FCPIs also possess excellent thermal property, especially when the addition amount is 0.3wt%, the 5% weight loss temperature could be as high as 540 oC and the glass transition temperature is 385 oC. Furthermore, the tensile strength of the film is 127 MPa, the elongation at break is around 15.82%, and the Youngs’ modulus is about 3.10 GPa. So, the successful preparation of the FCPI nanocomposites not only possess low-temperature curing and low-dielectric performance but also exhibit excellent thermal and mechanical properties, which shows a wide range of application prospects in the field of microelectronics for the advanced electronic package.

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Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole

Cited by 22 publications

References 34 publications

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties

Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties

In-situ polymerization of low-dielectric fluorinated nano carbon/polyimide composites with low-temperature curable property

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