2019
DOI: 10.1016/j.jmmm.2019.04.008
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Low-temperature crystallisation of Heusler alloy films with perpendicular magnetic anisotropy

Abstract: We demonstrate that perpendicular anisotropy can be induced in Co 2 FeAl 0.5 Si 0.5 by depositing the Heusler alloy on a tungsten seed layer. This is increased by elevating the deposition temperature to a moderate value up to 335 K. These perpendicular layers can be implemented into GMR devices, showing layer-thickness dependent switching without the use of an antiferromagnetic pinning-layer. These layers can be implemented into the manufacturing process of read-heads, where temperatures are limited.

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Cited by 10 publications
(9 citation statements)
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References 22 publications
(25 reference statements)
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“…A similar crystallisation process has been demonstrated at a higher temperature to uniformly crystallise the Heusler alloy films [ 53 ]. Further reduction has been achieved using a W(110) seed layer, allowing over 80% B 2 ordering by annealing at 355 K for 2 min [ 54 ]. Such layer-by-layer crystallisation can open a way for the implementation of a Heusler alloy film into spintronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…A similar crystallisation process has been demonstrated at a higher temperature to uniformly crystallise the Heusler alloy films [ 53 ]. Further reduction has been achieved using a W(110) seed layer, allowing over 80% B 2 ordering by annealing at 355 K for 2 min [ 54 ]. Such layer-by-layer crystallisation can open a way for the implementation of a Heusler alloy film into spintronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…The CFAS(220) diffraction ring was observed at 5.1 nm −1 from the centre spot. Therefore, the lattice constant of CFAS is estimated to be 0.57 nm, which is 101.3% of the CFAS film grown at 673 K estimated by the corresponding XRD result previously 5 . The structural analysis via TEM imaging confirmed CFAS pillars after the current introduction was partially crystallised and maintained a smooth interface of < 1 nm roughness in the GMR junction.…”
Section: Resultsmentioning
confidence: 76%
“…A multilayer of W (20)/Co 2 FeAl 0.5 Si 0.5 (CFAS) Heusler-alloy (10)/W (3)/CFAS (5)/Ru (3) (thickness in nm) as optimised previously 5 was grown on a thermally oxidised Si substrate using a high target utilisation sputtering system (PlasmaQuest, HiTUS) at room temperature. The multilayer was patterned into a nanopillar junction using a combination of electron-beam lithography and Ar-ion milling using the same process as previously reported 4 , 5 . Here, a seed layer, Cr/W, was patterned into a bottom electrode with a width of 100–200 nm.…”
Section: Methodsmentioning
confidence: 99%
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“…A multilayer of W (10)-CFAS (12. using a combination of electron-beam lithography and Ar-ion milling using the same process as previously reported [19]. Here, a seed layer, Cr-W, was patterned into a bottom electrode with a width of 100-200 nm.…”
Section: Methodsmentioning
confidence: 99%