Low-Temperature Cross-Linkable Hole Transport Material Based on Carbazole Derivatives Design and Applications in Solution-Processed OLEDs
Zhou Zhou,
Yupeng Li,
Xingxing Tang
et al.
Abstract:Cross-linking is demonstrated to be an effective strategy
to resolve
the interface erosion problem facing solution process technique for
large area commercial applications of organic electronics. However,
most of the reported cross-linkable materials require a high temperature
of over 150 °C, which is detrimental to device performance. In
this study, an in situ cross-linking protocol is proposed based on
a triphenylamine/carbazole core linked with a hexyl chain and styryl
moiety, and a low cross-linking temper… Show more
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