Dielectric Materials for Wireless Communication 2008
DOI: 10.1016/b978-0-08-045330-9.00012-1
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Low Temperature Cofired Ceramics

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Cited by 12 publications
(5 citation statements)
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References 296 publications
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“…Low-temperature co-fired ceramics (LTCCs) are dielectric materials that can be co-fired with Ag or Cu, which are metals that exhibit low-resistance conduction at temperatures below their melting points (961 and 1084 °C, respectively) [ 1 , 2 ]. LTCCs have been widely used in small electronic devices, such as wiring substrates and integrated circuit packages for high-frequency communication.…”
Section: Introductionmentioning
confidence: 99%
“…Low-temperature co-fired ceramics (LTCCs) are dielectric materials that can be co-fired with Ag or Cu, which are metals that exhibit low-resistance conduction at temperatures below their melting points (961 and 1084 °C, respectively) [ 1 , 2 ]. LTCCs have been widely used in small electronic devices, such as wiring substrates and integrated circuit packages for high-frequency communication.…”
Section: Introductionmentioning
confidence: 99%
“…This is also a perovskite-type material with a high insulation resistance and advantageous dielectric properties [ 5 ]. As a result of their high dielectric permittivity and low dielectric loss, BaTiO 3 , its SrTiO 3 counterpart, and their BaSrTiO 3 compositions are the most common dielectric ceramics used in communication [ 6 ], micro- and nano-electronics [ 7 ], or new generation photonics [ 8 ]. However, for 3D printing technology and other flexible device applications, the poor flexibility of BaTiO 3 , SrTiO 3 , and BaSrTiO 3 limits their applications at a large scale.…”
Section: Introductionmentioning
confidence: 99%
“…Low-temperature co-fired ceramics (LTCCs) have been attracting attention over recent decades due to rapid advances in wireless telecommunications, including the 5th generation (5G) tactile internet and the Internet of Things (IoT) [ 1 ]. LTCCs have characteristics that require sintering at temperatures of less than 1000 °C in order to be co-fired with electrode materials, such as Cu (melting point: 1083 °C), Ag (melting point: 961 °C), or Au (melting point: 1061 °C) [ 2 ]. LTCC devices provide a solution for integrating passive components, e.g., capacitors and resistors, with these electrodes into a three-dimensional module at the same time.…”
Section: Introductionmentioning
confidence: 99%