Low temperature co-fired ceramics with ultra-low sintering temperature: A review

Sebastian, Mailadil Thomas; Wang, Hong; Jantunen, Heli

doi:10.1016/j.cossms.2016.02.004

Cited by 251 publications

(118 citation statements)

References 89 publications

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“…High‐frequency dielectric materials are of interest for a wide variety of applications, such as electronic packaging, substrates, and functional components, including filters, baluns, couplers, antennas, and metamaterials . According to the different sintering temperatures, typical dielectric ceramics are categorized into high‐temperature co‐fired ceramics (HTCC), low‐temperature co‐fired ceramics (LTCC), and more recently, introduced ultra‐low temperature co‐fired ceramics (ULTCC) . In the case of these three categories, the respective sintering temperature ranges of ceramics are 1200°C‐1800°C, 900°C‐1000°C, and 400°C‐700°C.…”

Section: Introductionmentioning

confidence: 99%

“…In the case of these three categories, the respective sintering temperature ranges of ceramics are 1200°C‐1800°C, 900°C‐1000°C, and 400°C‐700°C. For LTCC and ULTCC, the low sintering temperature makes it possible to co‐fire ceramics with highly conductive, low melting metal electrodes such as copper, silver, and aluminum, enabling the fabrication of miniaturized and integrated microwave devices …”

Section: Introductionmentioning

confidence: 99%

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Cold sintering process: A new era for ceramic packaging and microwave device development

et al. 2016

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Cold sintering process (CSP) is an extremely low‐temperature sintering process (room temperature to ~200°C) that uses aqueous‐based solutions as transient solvents to aid densification by a nonequilibrium dissolution‐precipitation process. In this work, CSP is introduced to fabricate microwave and packaging dielectric substrates, including ceramics (bulk monolithic substrates and multilayers) and ceramic‐polymer composites. Some dielectric materials, namely Li2MoO4, Na2Mo2O7, K2Mo2O7, and (LiBi)0.5MoO4 ceramics, and also (1−x)Li2MoO4−xPTFE and (1−x)(LiBi)0.5MoO4−xPTFE composites, are selected to demonstrate the feasibility of CSP in microwave and packaging substrate applications. Selected dielectric ceramics and composites with high densities (88%‐95%) and good microwave dielectric properties (permittivity, 5.6‐37.1; Q × f, 1700‐30 500 GHz) were obtained by CSP at 120°C. CSP can be also used to potentially develop a new co‐fired ceramic technology, namely CSCC. Li2MoO4−Ag multilayer co‐fired ceramic structures were successfully fabricated without obvious delamination, warping, or interdiffusion. Numerous materials with different dielectric properties can be densified by CSP, indicating that CSP provides a simple, effective, and energy‐saving strategy for the ceramic packaging and microwave device development.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cold sintering process: A new era for ceramic packaging and microwave device development

et al. 2016

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“…During the production of LTCCs, the densification temperature should be lower than the melting point of the Ag or Cu electrode material (eg, 961°C for Ag). In addition, LTCCs should have a low dielectric constant ( ε r ), a high quality factor ( Q × f ), and a near‐zero temperature coefficient of the resonant frequency ( τ f ) to obtain microwave substrate components with excellent properties …”

Section: Introductionmentioning

confidence: 99%

Crystal structure, dielectric properties, and lattice vibrational characteristics of LiNiPO₄ ceramics sintered at different temperatures

Xiao

Cao

et al. 2019

J Am Ceram Soc

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LiNiPO 4 (LNP) ceramics were synthesized using a conventional solid-state reaction method and different sintering temperatures. Differential scanning calorimetry (DSC), thermogravimetric (TG) analysis, and X-ray diffraction (XRD) measurements indicated that single-phase olivine (Pnma, No. 62) was formed above 750°C, and dense LNP ceramic with a theoretical density of more than 95% was obtained at 825°C. Raman and far-infrared (IR) vibrational modes were assigned and discussed in detail. The intrinsic dielectric properties of the samples were calculated using the four-parameter semi-quantum (FPSQ) model based on far-IR reflectance spectroscopy and were in good agreement with the measured values. A positive relationship existed between the Raman shift of the υ 1 mode (attributed to the symmetric vibration of [PO 4 ] 3− ) and the corrected permittivity, and the opposite correlation was observed between the quality factor (Q × f) and the damping of the υ s mode as well as the distortion of the [NiO 6 ] octahedra. The optimized microwave dielectric properties of the LNP ceramics sintered at 825°C include an ultralow dielectric constant (5.18) and a good quality factor (24 076 GHz, f = 17.2 GHz). K E Y W O R D Sdielectric properties, lattice vibrational characteristics, microwave dielectric ceramics, olivine type, structure-property relationship | 2529 XIAO et Al.

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“…For microwave devices, Li 2 MoO 4 is of interest because of its beneficially low dielectric loss in addition to its low sintering temperature of 540 °C 19,20 . However, Li 2 MoO 4 is water-soluble, enabling component manufacture at temperatures as low as room temperature 21–24 .…”

Section: Introductionmentioning

confidence: 99%

3D printed dielectric ceramic without a sintering stage

Väätäjä

Kähäri

Ohenoja

et al. 2018

Sci Rep

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This paper presents for the first time the fabrication of dielectric ceramic parts by 3D printing without sintering. The printable paste was prepared by mixing a carefully selected amount of water-soluble Li2MoO4 powder with water. A viscous mixture of solid ceramic particles and saturated aqueous phase was formed with a solid content of 60.0 vol.%. Printing of the sample discs was conducted with material extrusion using a low-cost syringe-style 3D printer. The consolidation and densification of the printed parts occurred during both printing and drying of the paste due to extrusion pressure, capillary forces, and recrystallization of the dissolved Li2MoO4. Complete drying of the paste was ensured by heating at 120 °C. The microstructure showed no delamination of the printed layers. Relatively high densities and good dielectric properties were obtained, especially when considering that no sintering and only pressure from the extrusion was employed. This approach is expected to be feasible for similar ceramics and ceramic composites.

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Low temperature co-fired ceramics with ultra-low sintering temperature: A review

Cited by 251 publications

References 89 publications

Cold sintering process: A new era for ceramic packaging and microwave device development

Cold sintering process: A new era for ceramic packaging and microwave device development

Crystal structure, dielectric properties, and lattice vibrational characteristics of LiNiPO₄ ceramics sintered at different temperatures

3D printed dielectric ceramic without a sintering stage

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Low temperature co-fired ceramics with ultra-low sintering temperature: A review

Cited by 251 publications

References 89 publications

Cold sintering process: A new era for ceramic packaging and microwave device development

Cold sintering process: A new era for ceramic packaging and microwave device development

Crystal structure, dielectric properties, and lattice vibrational characteristics of LiNiPO4 ceramics sintered at different temperatures

3D printed dielectric ceramic without a sintering stage

Contact Info

Product

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Crystal structure, dielectric properties, and lattice vibrational characteristics of LiNiPO₄ ceramics sintered at different temperatures