Low Stress Solution of Anodic Bonding Technology with SW-YY<sup>®</sup> Glass for Sensitive MEMS

Hu, Xiaodong; Mackowiak, Piotr; Baeuscher, Manuel; Zhang, Yucheng; Wang, Bei; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Ehrmann, O.; Lang, Klaus‐Dieter; Ngo, Ha-Duong

doi:10.1109/eptc.2018.8654362

Cited by 1 publication

(1 citation statement)

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“…A peraluminus LAS glass (SW-YY ® ) from Ashahi Glass Co. was successfully demonstrated for its bonding capability at a lower temperature (250-500°C) and low voltage (400-800 V) [284,285]. Anodic bonding between LTCC wafer with Au electrical interconnect and silicon on insulator (SOI) wafer was confirmed for its hermetic sealing and health of interconnections through 3000 cycle thermal shock test [286].…”

Section: Anodic Bondingmentioning

confidence: 99%

Lithium aluminosilicate (LAS) glass-ceramics: a review of recent progress

Venkateswaran

Sreemoolanadhan

Vaish

2021

International Materials Reviews

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The lithium aluminosilicate system (LAS) is being explored for almost seven decades due to its anomalous and attractive properties (especially low/negative thermal expansion and fast ion conduction) and its commercial significance in consumer as well as strategic sectors. This review introduces current commercial applications of LAS systems, necessary background science, structural features of different LAS crystal systems, including their polymorphs and solid-solutions, and the origin of unusual properties. Significant emphasis is provided on processing transparent, nanocrystalline, low thermal expansion glass-ceramic (LEGC), the role of chemical constituents and additives, the effect of heat-treatment, and microstructural evolution while processing LEGC. Detailed discussions are provided on the following areas: LAS matrix composites, chemical strengthening of glass and glass-ceramic, low temperature co-fired ceramics (LTCC) and associated joining technologies (hydrolysis catalysis bonding, anodic bonding, brazing, etc.) that would further extend the application portfolio of LAS system.

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Section: Anodic Bondingmentioning

confidence: 99%