Low-Shrinkage and Degradable UV Imprint Lithography Based on Biomass-Derived Epoxidized Soybean Oil and Cardanol

Abstract

Ultraviolet (UV) imprint lithography plays an important role in the electronic information field as a form of microstructure molding. Herein, a novel photoresist with an extremely low volume shrinkage (1.17%) and excellent degradation ability was developed for UV imprint lithography based on biorenewable cardanol, epoxy soybean oil, and tripropylene glycol diacrylate via combined free radical/cationic dual curing. The viscosity of modified cardanol was only one-seventh that of epoxy soybean oil and can be used as an excellent reactive diluent. The initiation efficiency and cross-linking density were significantly improved, showing an outstanding thermal stability (T 5% of 312.8 °C), excellent adhesion (3.9 MPa), and high gel content (92.7%). More importantly, the photoresist manifested an excellent pattern transfer ability, and the adhesive displayed an excellent removability from the mold by introducing zinc acetyl acetone. This work provides a promising route to produce a high-performance photoresist with biomass derivatives.