Abstract:In this work, we demonstrate on a new interconnection technology which can be used for bonding Flip-Chips with 5-lm-Bumps and fine pitches <5 lm. In this technology, the bumps on both joint partners are coated with metallic nanowires (in most cases copper, in rare cases gold), through an in situ electrochemical deposition process, the so-called NanoWiring process. The diameter of the wires can be adjusted between 30 and 4000 nm, and their length is ranged from 4 to 50 lm. The process is scaled up for 12 inch w… Show more
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