Abstract:Recently, Wafer Level Chip Scale Package (WLCSP) Package is being rapidly adopted in Internet of Things (IoT) and consumer mobile electronics due to its low profile, small form factor and relatively easy assembly process. WLCSP with large die size becomes the trend in fulfilling high performance product demands. However, the solder joint reliability performances of WLCSP is the key challenge and becomes critical as increasing die size, especially the size is larger than 6 × 6 mm2. There is also growing intere… Show more
Set email alert for when this publication receives citations?
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.