Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

“…Owing to the increased use of electric vehicles, high-power charging stations, and 5G technology, power devices are now required to withstand high switching speeds, power outputs, and current densities. , Therefore, wide-bandgap semiconductors such as SiC and GaN, which have superior physical and electrical properties, are gradually replacing Si in power devices to meet these harsh requirements . High current densities may result in significant Joule heating and temperature increases of over 250 °C in the dies of power devices . In most power-device manufacturing processes, dies are attached to substrates using Sn-based solders .…”

“…3 High current densities may result in significant Joule heating and temperature increases of over 250 °C in the dies of power devices. 4 In most power-device manufacturing processes, dies are attached to substrates using Sn-based solders. 5 However, because the melting point of Sn-based solders is low, such as the melting point of 217−219 °C of Sn-3.0Ag-0.5Cu solder, these solders tend to experience remelting and serious stability issues at high operating temperatures exceeding 250 °C.…”

Development of Ag–In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor Devices

“…To address the aforementioned issues, Lee and coworkers pointed out that a joint comprising Ag-In intermetallic compounds (IMCs) exhibited excellent properties compared to pure Ag joints [18,19]. Moreover, our previous studies have proven that the addition of In to sintered Ag joints has positive effects on the sintered joint [20][21][22][23][24][25]. The sintered Ag-In joint produced via the transient liquid phase (TLP) bonding reaction between the Ag paste and In foil significantly improved the mechanical properties and reduced oxidation problems of the sintered joints at high temperatures.…”

“…Hence, the fabrication process for the sintered Ag-In joint using In foil is not fully compatible with large-scale manufacturing. Furthermore, the sintered Ag-In joint produced via the TLP reaction needed to undergo a long-term phase transformation from brittle Ag-In IMCs to a ductile Ag-In solid solution to achieve the optimal mechanical properties and compositional homogenization [24,25]. Consequently, despite the excellent properties of sintered Ag-In joints, it is not practical to use In foil in industrial applications because it cannot be mass-produced, which restricts the application of sintered Ag-In joints.…”