Low‐power and low‐noise complementary metal oxide semiconductor distributed amplifier using the gain‐peaking technique

Abstract

Summary This paper presents an improved topology for ultra‐low‐power complementary metal oxide semiconductor (CMOS) distributed amplifier (DA) based on modified folded cascode gain cells. The proposed CMOS‐DA can be applicable in low‐supply‐voltage applications, because of the use of folded gain cell's structure. The proposed DA decreases power consumption by employing the forward body biasing network, while maintains high gain. By using a gain‐peaking inductor at the gate of the transistor, the proposed DA structure achieved to the gain flatness in high frequencies while the bandwidth is improved as well. In addition, employing RC network at the body terminal improves the noise performance of the proposed DA. The DA architecture consists of three amplification stages. Detailed analysis is provided for the proposed folded cascode DA. According to the post‐layout simulation results of the proposed amplifier using a 0.13‐µm CMOS process, DA achieves power gain of 17.3 ± 0.8 dB in bandwidth of 14.5 GHz, a good input third‐order intercept point (IIP3) of +5.5 dBm. The minimum noise figure is 1.8–5 dB, and input and output return losses are less than −11.5 dB and −10 dB, respectively, and the proposed structure consumes 12 mW from a 0.5 V voltage supply. Copyright © 2016 John Wiley & Sons, Ltd.