Low peel strength investigation in direct gold System in Package module

Lo, Tsung Nan; Liu, Wei; Macatangay, Aldy; Molla, J.; Hiew, Pey Fang

doi:10.1109/iemt55343.2022.9969472

2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) 2022

DOI: 10.1109/iemt55343.2022.9969472

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Low peel strength investigation in direct gold System in Package module

Tsung Nan Lo¹,

Wei Liu²,

Aldy Macatangay³

et al.

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Low peel strength investigation in direct gold System in Package module

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References 7 publications

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