Low-Order Identification of Interconnects With the Generalized Method of Characteristics

Magistris, M. de; Tommasi, Luciano De; Maffucci, Antonio; Miano, G.

doi:10.1109/temc.2007.902195

Cited by 5 publications

(3 citation statements)

References 18 publications

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“…Indeed, the S-parameters are the natural frame for a high-frequency characterization of a PCB, either based on full-wave simulations (as done in this paper) or on measurements. After the Y-matrix is retrieved from Equation (2), a low-order equivalent circuit may be derived through a synthesis procedure based on the vector fitting technique, as in [22]. Indeed, the generic entry of the admittance matrix can be expressed in terms of a truncated series of pole-residue pairs:…”

Section: Circuital Model For Evaluating the Conducted Emissionmentioning

confidence: 99%

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Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

2018

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This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the conducted emission, an equivalent circuit model is derived to describe the IC and the effect of its loads (package, printed circuit board, decaps, etc.), based on the Integrated Circuit Emission Model template (ICEM). As for the radiated emission, an electromagnetic model is proposed, based on the superposition of the fields generated in the far field region by the loop currents flowing into the IC and the package pins. A custom experimental setup is designed for validating the models. Specifically, for the radiated emission measurement, a custom test board is designed and realized, able to highlight the contribution of the direct emission from the IC, usually hidden by the indirect emission coming from the printed circuit board. Measurements of the package currents and of the far-field emitted fields are carried out, providing a satisfactory agreement with the model predictions.

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Section: Circuital Model For Evaluating the Conducted Emissionmentioning

confidence: 99%

“…and the pole-residue pairs may be associated to R-L or R-C branches in the final circuit model [22].…”

Section: Circuital Model For Evaluating the Conducted Emissionmentioning

confidence: 99%

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

2018

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“…Unlike the signal interconnects, where the propagation plays a fundamental role, hence any accurate circuit model must handle a huge number of poles, a PDN is usually characterized by a huge number of nodes, but at a low number of poles. Therefore, modest results can be achieved for PDNs when using popular model-order reduction techniques suitable for signal interconnects, such as those based on subspace projections [5]- [7]. Recently, new reduction approaches have been proposed for electrical networks, based on the concept of node reduction [8]- [9].…”

Section: Introductionmentioning

confidence: 99%

A clustering technique for fast electrothermal analysis of on-chip power distribution networks

Magnani

Magistris

Maffucci

et al. 2016

2016 IEEE 20th Workshop on Signal and Power Integrity (SPI)

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This paper presents an equivalent self-consistent electrothermal circuit model for power integrity analysis of large on-chip power distribution networks. Two coupled circuits are used to co-simulate the electrical and thermal behavior of the power grid. After a steady-state analysis, the order of the circuit is strongly reduced by means of a node clustering technique. The obtained low-order circuit allows a cost-effective complete power integrity analysis, including dynamic analysis and evaluation of time-domain features like voltage droop. As a case-study, a 45-nm chip power grid is analyzed: the full circuit for the electrothermal model with 4 million nodes is reduced by a factor of about 3500×, with a relative error on the solution below few percent

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Quasi-TEM approach of coupled-microstrip lines and its application to the analysis of microstrip filters

Xiao

Norgren

2011

Int J RF and Microwave Comp Aid Eng

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In this article, the quasi-TEM approach is successfully used to analyze coupled-microstrip lines of finite length, which are usually used for the coupling between the source/load and resonators in microstrip filters. First, an orthogonal expansion method is used to extract the per-length inductance and capacitance matrices. The authors then obtain the impedance matrix or admittance matrix, which relates the voltages and currents at both ends of coupled-microstrip lines. To verify our theory, an example is presented, i.e., a Y-shaped dual-mode bandpass microstrip filter, for which, the equivalent circuit model based on the quasi-TEM analysis of coupled-microstrip lines is accurately set up. The approach in this article is applicable to planar microstrip lines with arbitrary number of conductors, under the quasi-TEM assumption. V C 2011 Wiley Periodicals, Inc. Int J RF and Microwave CAE 22:131-139, 2012.

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Low-Order Identification of Interconnects With the Generalized Method of Characteristics

Cited by 5 publications

References 18 publications

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits

A clustering technique for fast electrothermal analysis of on-chip power distribution networks

Quasi-TEM approach of coupled-microstrip lines and its application to the analysis of microstrip filters

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