Low K CMOS65 Ball Grid Array 40μm Pitch Wire Bonding Process Development

Abstract

of the product of the total resistance and capacitance of the IC performance and cost drive interconnect dimensions to whole interconnects structure. Lowing the dielectric constant shrink to ever-smaller sizes the RC delay becomes the between the interconnect layers and copper metallization dominant factor to impact IC performance. The RC delay is a became necessary.[1]. function of the product of the total resistance and capacitance Low-k is generally defined as K value of less than 3dusow of the whole interconnects structure. To reduce RC delay, k materials are introduced to the semiconductors industry copper interconnects were introduced to replace aluminum. At mainly to improve capacitance, device speed, and signal