Low g Inertial Sensor based on High Aspect Ratio MEMS

Reze, Matthieu; Hammond, J.M.

doi:10.1007/3-540-27463-4_34

Cited by 5 publications

(3 citation statements)

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“…However, the capacitances of sensing electrodes are limited by the poly-Si thickness (2 μm) of comb-fingers. The high aspect ratio processes capable of defining narrow trenches and thick comb-electrodes provide the solution to increase sensing capacitance substantially [23]. The differential capacitive sensing SOI accelerometer using vertical-combs is presented in [27].…”

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“…Moreover, CMOS-MEMS multi-layer comb-electrodes accelerometer has also been demonstrated in [10]. The poly-Si micromachining is also a mature technology to fabricate commercial capacitive accelerometers [23], [28], [29]. However, the surface micromachining technology for accelerometer design has some limitations, such as the size of proof mass and the sensing area.…”

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“…The capacitive sensing is a promising technique for accelerometer because of its high sensitivity, low drift, good noise performance, simplicity, and low temperature sensitivity. Using comb-electrodes to implement differential capacitive-sensing is the most popular approach for accelerometer [23]- [25]. The commercial capacitive accelerometer has been realized by poly-Si micromachining and BiMOS process [26].…”

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Poly-Si Based Two-Axis Differential Capacitive-Sensing Accelerometer

Chan

Huang

et al. 2012

IEEE Sensors J.

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This paper reports the design and implementation of a two-axis capacitive-type accelerometer using well-known two poly-Si processes. The accelerometer design consists of a pendulum proof-mass (bulk Si), a gimbal-spring (poly-Si film), and vertical-comb sensing electrodes. This design has three merits: 1) pendulum proof-mass to produce torque by in-plane acceleration; 2) high-aspect-ratio-micromachined (HARM) gimbal-springs enable the detection of two-axis accelerations; and 3) vertical-combs of different vertical positions enable the differential sensing electrodes design to detect the angular motion. In short, this paper exploits the vertical-comb electrodes for differential capacitive sensing to detect the two-axis in-plane accelerations. Measurement results show that the sensitivities (nonlinearity) of etch direction are 17.87 mV/G (2.65%) of X-axis, and 16.54 mV/G (2.71%) of Y-axis in the excitation range of 0.6 ∼ 2 G. Due to the HARM gimbal-spring design, the cross axis sensitivity introduced by the Z-axis excitation is less than 0.3% for both X-axis and Y-axis sensing. However, the cross-axis error between the X-axis and the Y-axis sensing elements still need to be improved.

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