Low Firing Temperature Multilayer Glass-Ceramic Substrate

Shimada, Yuzo; Utsumi, Kazuaki; Suzuki, Masayoshi; Takamizawa, H.; Nitta, M.; Watari, T.

doi:10.1109/tchmt.1983.1136194

Cited by 70 publications

(27 citation statements)

References 5 publications

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“…[1][2][3][4][5][6] This technology has not been restricted within the conventional ceramic packaging techniques, but has been extended to novel high dense packages incorporating various conductive and passive components. [7][8][9][10] One way to achieve dense packages may be the use of LTCC hetero-structures having different functionality. 11 There are various material parameters that need to be considered for the successful integration of the LTCC materials as overall performance.…”

Section: Introductionmentioning

confidence: 99%

Shrinkage behavior of LTCC hetero-laminates

Lim

Cho

Seo

et al. 2009

Journal of the European Ceramic Society

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Section: Introductionmentioning

confidence: 99%

Shrinkage behavior of LTCC hetero-laminates

Lim

Cho

Seo

et al. 2009

Journal of the European Ceramic Society

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“…Several approaches to the preparation of LTCC systems have been reported including glass+ceramics (multiphase ceramics) [7][8][9][10] and glass-ceramics (crystallizable glass). [11][12][13][14][15][16] The T2000 tape dielectric of Motorola is a LTCC glassceramic material system that includes a specially formulated K 2 O-CaO-SrO-BaO-B 2 O 3 -SiO 2 (TG) glass, Al 2 O 3 as ceramic filler and TiO 2 as a T f (temperature coefficient of resonant frequency) adjustment agent. 1,2) In the first paper of this series, 17) two crystalline phases of cristobalite (SiO 2 ) and pseudowollastonite [(Ca, Ba, Sr)SiO 3 ] are reported to precipitate out of the initially amorphous, crystallizable TG glass powder at temperatures from 800 to 1000 C. The formation of crystalline phases exhibits a characteristic incubation period that decreases with increasing sintering temperature.…”

Section: Introductionmentioning

confidence: 99%

Effects of Alumina on Devitrification Kinetics and Mechanism of K₂O–CaO–SrO–BaO–B₂O₃–SiO₂Glass

Jean¹,

Fang²,

Dai

et al. 2003

Jpn. J. Appl. Phys.

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Effects of alumina on the devitrification kinetics and mechanism of a low-dielectric K 2 O-CaO-SrO-BaO-B 2 O 3 -SiO 2 glass powder have been investigated. Crystalline phases including cristobalite (SiO 2 ) and pseudowollastonite [(Ca, Ba, Sr)SiO 3 ] are formed during the firing of the pure glass. With added alumina content greater than a critical value, e.g., 10-20 vol% at 900-1000 C, the above crystalline phases are completely prevented but anorthite [(Ca, Sr, Ba)Al 2 Si 2 O 8 ] is formed. This result is attributed to the dissolution of alumina into the glass. The dissolution changes the composition of the glass to become aluminum-rich, and the dissolution kinetics of alumina into the glass is far too rapid compared with the formation of cristobalite and pseudowollastonite. The crystallization kinetics of anorthite follows the analysis of the Avrami equations, and the results show an apparent activation energy close to that of the Al-O bond strength, suggesting a reaction-controlled kinetics.

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“…The concepts of external and buried-in thick-film LTCC resistors are logical progressions toward higher circuit density and savings in top-level real estate. Many thick-film and ceramic manufacturers have embarked on programs to develop materials suitable for LTCC technology [71][72][73].…”

Section: Multilayer Technology Using Ltccmentioning

confidence: 99%

Thick‐Film Fundamentals

2003

Handbook of Thick‐ and Thin‐Film Hybrid Microelectronics

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Engineers and scientists adopt materials and energy to society's needs. Since all disciplines in engineering and science involve the design of technical products, and all engineering disciplines encounter materials, it is essential to learn the properties and behavior of the types of materials used in a particular engineering product. Similarly, thick-film hybrid microcircuitry, which represents a packaging approach for electronic components intermediate between the conventional assembly of discrete components mounted on a printed board and monolithic integrated circuits is dependent on materials [1]. A thick-film hybrid microcircuit has components such as resistors, capacitors, and conductors, which are screen printed on alumina substrate [2,3]. The film resistor and the conductor used in a thick-film hybrid circuit are composed of mixtures of particulates of metals, metal oxides, and fine glass powders suspended in organic binders. The dielectric paste (ink), on the other hand, is composed of insulating materials such as oxides of metals and semiconductors and fine glass powders suspended in organic binders. Proper handling of these materials depends on knowledge of their physical, chemical, mechanical, and electrical properties. The e¤ect that one material may have on another material within a hybrid circuit is of extreme concern [4]. Therefore, material substitutions that are being contemplated should be reviewed to determine whether a material selected is susceptible to malfunction under harsh conditions. Nonconforming materials can result in failure of hybrid circuits caused by one or more of the following: metal migration [5], corrosion or oxidation [6], ionic contamination [7,8], improper adhesion [9], intermetallic formation [6,10], and di¤erences in thermal 126 Handbook of Thick-and Thin-Film Hybrid Microelectronics,

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Low Firing Temperature Multilayer Glass-Ceramic Substrate

Cited by 70 publications

References 5 publications

Shrinkage behavior of LTCC hetero-laminates

Shrinkage behavior of LTCC hetero-laminates

Effects of Alumina on Devitrification Kinetics and Mechanism of K₂O–CaO–SrO–BaO–B₂O₃–SiO₂Glass

Thick‐Film Fundamentals

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Low Firing Temperature Multilayer Glass-Ceramic Substrate

Cited by 70 publications

References 5 publications

Shrinkage behavior of LTCC hetero-laminates

Shrinkage behavior of LTCC hetero-laminates

Effects of Alumina on Devitrification Kinetics and Mechanism of K2O–CaO–SrO–BaO–B2O3–SiO2Glass

Thick‐Film Fundamentals

Contact Info

Product

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Effects of Alumina on Devitrification Kinetics and Mechanism of K₂O–CaO–SrO–BaO–B₂O₃–SiO₂Glass