Low‐Energy UV Ultrafast Laser Controlled Lift‐Off for High‐Quality Flexible GaN‐Based Device (Adv. Funct. Mater. 8/2022)

Sun, Weigao; Ji, Lingfei; Zhao, Lin; Zheng, Jincan; Wang, Zhiyong; Zhang, Litian; Yan, Tianyang

doi:10.1002/adfm.202270051

Cited by 3 publications

(2 citation statements)

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“…[ 18 ] In our previous work, a picosecond laser microcavity lift‐off strategy was proposed to achieve rapid non‐destructive separation of a large‐area gallium nitride (GaN) epitaxial film of blue LEDs. [ 19 ] But for mass transfer of µ‐LED chips with complex 3D structures and the unit dimension equal to or <≈20 µm, the anisotropic mechanical response characteristics of the chips bring a greater challenge for the laser transfer process. It is crucial to enhance the deposition uniformity of ultrafast laser energy at the µ‐LED/substrate interface and achieve a controllable fabrication process for flexible µ‐LEDs.…”

Section: Introductionmentioning

confidence: 99%

20 µm Micro‐LEDs Mass Transfer via Laser‐Induced In Situ Nanoparticles Resonance Enhancement

Sun,

Ji,

Lin

et al. 2024

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Ultrafast laser is expected as a promising strategy for micro‐LEDs (µ‐LEDs) transfer due to its inherent property of suppressing thermal effects. However, its ultrahigh peak power and the unclear transfer mechanism make its transfer quality and efficiency unsatisfactory. Here, the study reports the high‐precision mass transfer of 20 µm fine‐pitch µ‐LEDs via in situ nanoparticles (NPs) resonance enhancement in burst mode ultraviolet picosecond laser irradiation. This technique suppresses the thermal melting effect and rapid cooling behavior of plasma by temporal modulation of the burst mode, generating NPs‐induced resonance enhancement that accurately and controllable drives a single unit up to tens of thousands of µ‐LEDs. The transfer of large µ‐LED arrays with more than 180 000 chips is also demonstrated, showing a transfer yield close to 99.9%, a transfer speed of 700 pcs s−1, and a transfer error of <±1.2 µm. The transferred µ‐LEDs perform excellent optoelectronic properties and enable reliable device operation regardless of complex strain environments, providing a reliable strategy for preparing broader classes of 3D integrated photonics devices.

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Section: Introductionmentioning

confidence: 99%

20 µm Micro‐LEDs Mass Transfer via Laser‐Induced In Situ Nanoparticles Resonance Enhancement

Sun,

Ji,

Lin

et al. 2024

Small

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“…These virtues lay their unique foundation in broad application fields like high‐threshold optical elements, micro‐heat sinks, and micro‐electromechanical systems. [ 1–5 ] Those devices usually require elaborately designed surface microstructures to achieve desired functions. For example, high damage threshold blazed gratings composed of parallel microgrooves with controllable angles are needed to achieve maximum diffraction efficiency in a designed diffraction order.…”

Section: Introductionmentioning

confidence: 99%

Patterned Laser Ablation of Microgrooves with Controllable Cross‐Sections

Qiu

Guo

Huang

et al. 2023

Adv Materials Technologies

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Fabricating precision microgrooves with controllable cross‐sections on difficult‐to‐machine materials is significantly valuable but still challenging. Herein, a patterned laser‐induced microjet‐assisted ablation method for cross‐sectional profiles controllable laser micromachining is proposed. During the liquid‐assisted laser ablation process, debris and bubbles that may disturb the laser energy deposition can be instantaneously expelled by a directional laser‐induced microjet. The Gaussian laser spot is spatially modulated into specific geometric shapes, such as triangles, to tune locally deposited laser energy to carve microgrooves with designed cross‐sections. To achieve customized microgrooves efficiently, a reliable geometrical model based on the ablation threshold theory is developed to guide the processing parameter selection, including the laser spot shape, polarization, pulse energy, and scanning strategies. The simulation and experimental results confirm that this method achieves the decoupled control of the groove depth and width in a single‐path laser ablation process. Using this method, the design and manufacturing of microgrooves with controllable cross‐sections on single crystalline silicon carbide are demonstrated. The patterned laser‐induced microjet‐assisted ablation method provides a new route for fabricating precision microgrooves with controllable cross‐sections on difficult‐to‐machine materials.

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Triple-wavelength mode-locked laser based on a Cr2Si2Te6 saturable absorber

Yang

Zhang

et al. 2023

Optical Fiber Technology

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Low‐Energy UV Ultrafast Laser Controlled Lift‐Off for High‐Quality Flexible GaN‐Based Device (Adv. Funct. Mater. 8/2022)

Cited by 3 publications

References 0 publications

20 µm Micro‐LEDs Mass Transfer via Laser‐Induced In Situ Nanoparticles Resonance Enhancement

20 µm Micro‐LEDs Mass Transfer via Laser‐Induced In Situ Nanoparticles Resonance Enhancement

Patterned Laser Ablation of Microgrooves with Controllable Cross‐Sections

Triple-wavelength mode-locked laser based on a Cr2Si2Te6 saturable absorber

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