Low energy electron beam decomposition of metalorganic precursors with a scanning tunneling microscope at ambient atmosphere

Brückl, Hubert; Kretz, Johannes; Koops, H. W. P.; Reiss, Günter

doi:10.1116/1.590759

Cited by 15 publications

(3 citation statements)

References 22 publications

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“…A high‐resolution method related to FEBID is the decomposition of the precursor molecules by the tunneling current of a scanning tunneling microscope (STM). This approach enables fabrication of features smaller than 10 nm even on bulky substrates . However, we found only one report of a high‐aspect‐ratio metal structure fabricated in an STM, a 9 nm wide and 880 nm high fiber made of crystalline bcc iron …”

Section: Discussionmentioning

confidence: 99%

Additive Manufacturing of Metal Structures at the Micrometer Scale

et al. 2017

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Currently, the focus of additive manufacturing (AM) is shifting from simple prototyping to actual production. One driving factor of this process is the ability of AM to build geometries that are not accessible by subtractive fabrication techniques. While these techniques often call for a geometry that is easiest to manufacture, AM enables the geometry required for best performance to be built by freeing the design process from restrictions imposed by traditional machining. At the micrometer scale, the design limitations of standard fabrication techniques are even more severe. Microscale AM thus holds great potential, as confirmed by the rapid success of commercial micro-stereolithography tools as an enabling technology for a broad range of scientific applications. For metals, however, there is still no established AM solution at small scales. To tackle the limited resolution of standard metal AM methods (a few tens of micrometers at best), various new techniques aimed at the micrometer scale and below are presently under development. Here, we review these recent efforts. Specifically, we feature the techniques of direct ink writing, electrohydrodynamic printing, laser-assisted electrophoretic deposition, laser-induced forward transfer, local electroplating methods, laser-induced photoreduction and focused electron or ion beam induced deposition. Although these methods have proven to facilitate the AM of metals with feature sizes in the range of 0.1-10 µm, they are still in a prototype stage and their potential is not fully explored yet. For instance, comprehensive studies of material availability and material properties are often lacking, yet compulsory for actual applications. We address these items while critically discussing and comparing the potential of current microscale metal AM techniques.

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Section: Discussionmentioning

confidence: 99%

Additive Manufacturing of Metal Structures at the Micrometer Scale

et al. 2017

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“…The most demonstrated direct-writing nanostructures resulted from using an electron beam, 1-3 focused ion beam, 4 laser, 5 and UV 6 as the source to decompose molecules and the chemical vapor deposition (CVD) of organometallic precursors including noble metals, Cu, 1 Cd, 7 Ni, 8 Au, 9 W, 10 and Pd, 11 in a vacuum system. However, the expensive and complex equipment operating in high vacuum needs to be carefully handled with custom vacuum systems.…”

Section: Introductionmentioning

confidence: 99%

Direct Nanofabrication of Copper on Silicon Substrate by Electrochemical Atomic Force Microscope Lithography

Kwon

Lee²

2009

jnn

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The electrochemical reaction by applying an electrical bias between an atomic force microscope (AFM) tip and a substrate was used to directly fabricate desired copper patterns. The negative sample bias could strongly reduce copper at the point localized by an AFM tip but not oxidize silicon. The mixture solution of Cu(NO 3 2 and poly(sodium 4-styrenesulfonate) which are highly soluble in water was used to form a conductive copper ion film. The arrayed dots and line patterns were fabricated by electrical exposure at regular steps and continuous bias, respectively. This technique demonstrated the fabrication of copper patterns by using the electrochemical reduction by AFM lithography.

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“…Direct-writing lithography has used various exposure sources including electrons assisted by a scanning probe microscope [9], an emitted electron beam [10], a focused ion beam [8], and a laser [11]. It has been introduced with chemical and physical deposition of various metal precursors to fabricate metal nanowires [12,13]. In particular, atomic force microscope (AFM) lithography is known as a direct, simple and inexpensive maskless lithographic tool in mechanical and electrochemical fabrication processes because it has few environmental restrictions under ambient conditions.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of uniform and high resolution copper nanowire using intermediate self-assembled monolayers through direct AFM lithography

et al. 2012

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Electrochemical AFM lithography was used to directly fabricate copper nanowires. The copper ions were strongly reduced by a negative sample bias at the point where the AFM tip was localized, and copper metal wires were successfully fabricated following the direction of the electrical field of the bias. A TDA⋅HCl self-assembled monolayer (SAM) was found to play an important role as an intermediate layer for enhancing the capability of high resolution and complete development after the AFM lithographic process. The physical and electrical properties of the wires were analyzed by AFM, EFM, SEM, TEM and I-V measurement. The fabricated copper has promising potential for applications such as masks and interconnectors for nanoelectronic devices.

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Low energy electron beam decomposition of metalorganic precursors with a scanning tunneling microscope at ambient atmosphere

Cited by 15 publications

References 22 publications

Additive Manufacturing of Metal Structures at the Micrometer Scale

Additive Manufacturing of Metal Structures at the Micrometer Scale

Direct Nanofabrication of Copper on Silicon Substrate by Electrochemical Atomic Force Microscope Lithography

Fabrication of uniform and high resolution copper nanowire using intermediate self-assembled monolayers through direct AFM lithography

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