“…After being peeled off the photosheet paper, wet-etching was performed for 15 min using ferric chloride hexahydrate (0.3 g of FeCl 3 .6H 2 O, 97%, M/s Loba chemie, India) solution to remove the unmasked region of copper coating from the PCB. The dimension of the wet-etch IDE was discussed elsewhere by Karthieka et al [12]. After cleaning using acetone, tin was over deposited on copper pattern by electroless deposition using a bath made of stannous chloride dihydrate (0.1 g of SnCl 2 .2H 2 O, 99%, M/s SRL, India), thiourea (0.4 g of CH 4 N 2 S, 99%, M/s SRL India) and sulphamic acid (0.6 g of H 3 NO 3 S, 99.5%, M/s SRL, India) in 20 ml of double-distilled water.…”